Invention Grant
- Patent Title: Compositions and methods for the electrodeposition of nanotwinned copper
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Application No.: US17005407Application Date: 2020-08-28
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Publication No.: US11384446B2Publication Date: 2022-07-12
- Inventor: Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
- Applicant: MacDermid Enthone Inc.
- Applicant Address: US CT Waterbury
- Assignee: MacDermid Enthone Inc.
- Current Assignee: MacDermid Enthone Inc.
- Current Assignee Address: US CT Waterbury
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D5/00 ; B82Y40/00 ; B82Y30/00
Abstract:
A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
Public/Granted literature
- US20220064812A1 Compositions and Methods for the Electrodeposition of Nanotwinned Copper Public/Granted day:2022-03-03
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