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公开(公告)号：US20240318342A1
公开(公告)日：2024-09-26
申请号：US18578049
申请日：2022-07-25
Applicant: MacDermid Enthone Inc.
Inventor： Jianwen Han , Pingping Ye , Kyle M Whitten , Stephan I. Braye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electrolyte comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electrolyte is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxy] may comprise a reaction product between 2,3-epoxy-1-propanol and an amine compound. A leveler comprising a polymeric quaternary nitrogen species and/or an accelerator comprising an organic sulfur compound may also be added to the copper electrolyte so long as the nanotwinned columnar copper grains are maintained.
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Patent Agency Ranking
公开(公告)号：US20240110306A1
公开(公告)日：2024-04-04
申请号：US18534819
申请日：2023-12-11
Applicant: MacDermid Enthone Inc.
Inventor： Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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公开(公告)号：US11384446B2
公开(公告)日：2022-07-12
申请号：US17005407
申请日：2020-08-28
Applicant: MacDermid Enthone Inc.
Inventor： Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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公开(公告)号：US11873568B2
公开(公告)日：2024-01-16
申请号：US17834265
申请日：2022-06-07
Applicant: MacDermid Enthone Inc.
Inventor： Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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公开(公告)号：US20220298665A1
公开(公告)日：2022-09-22
申请号：US17834265
申请日：2022-06-07
Applicant: MacDermid Enthone Inc.
Inventor： Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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公开(公告)号：US20220064812A1
公开(公告)日：2022-03-03
申请号：US17005407
申请日：2020-08-28
Applicant: MacDermid Enthone Inc.
Inventor： Kyle M. Whitten , Stephan I. Braye , Jianwen Han , Pingping Ye , Thomas B. Richardson , Elie H. Najjar
Abstract: A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.
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