- Patent Title: Silicide for group III-Nitride devices and methods of fabrication
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Application No.: US16144946Application Date: 2018-09-27
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Publication No.: US11387327B2Publication Date: 2022-07-12
- Inventor: Sansaptak Dasgupta , Marko Radosavljevic , Han Wui Then , Paul Fischer , Walid Hafez
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/285 ; H01L29/778 ; H01L21/033 ; H01L21/768 ; H01L29/49 ; H01L29/51 ; H01L21/321

Abstract:
A transistor includes a polarization layer above a channel layer including a first III-Nitride (III-N) material, a gate electrode above the polarization layer, a source structure and a drain structure on opposite sides of the gate electrode, where the source structure and a drain structure each include a second III-N material. The transistor further includes a silicide on at least a portion of the source structure or the drain structure. A contact is coupled through the silicide to the source or drain structure.
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