- 专利标题： Systems and methods for integrating power and thermal management in an integrated circuit
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申请号： US15855457申请日： 2017-12-27
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公开(公告)号： US11520388B2公开(公告)日： 2022-12-06
- 发明人: Sean R. Atsatt , Scott J. Weber , Aravind Raghavendra Dasu , Ravi Prakash Gutala
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Fletcher Yoder, P.C.
- 主分类号： G05B15/02
- IPC分类号： G05B15/02 ; G06F1/20 ; H03K19/0175 ; H03K19/003 ; H03K19/00 ; G06F1/3287 ; H01L23/538 ; G06F1/3296 ; H01L25/18 ; H01L23/367 ; H01L23/00 ; H01L23/34
摘要：
An integrated circuit assembly may include an integrated circuit having a plurality of programmable logic sectors and an interposer circuit positioned adjacent to the integrated circuit. The interposer circuit may include at least one voltage regulator that distributes a voltage to at least one of the plurality of programmable logic sectors and at least one thermal sensor that measures a temperature of the at least one of the plurality of programmable logic sectors.
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