Invention Grant
- Patent Title: Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions
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Application No.: US15942270Application Date: 2018-03-30
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Publication No.: US11557529B2Publication Date: 2023-01-17
- Inventor: Thomas Boyd , Ming-Chen Chang , Evan A. Chenelly , Divya Swamy Bandaru , Craig J. Jahne , Andrew Larson , Eric W. Buddrius , Eric D. McAfee , Mustafa Haswarey , Ralph V. Miele , Rolf Laido
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H01L23/40 ; H01L23/367
Abstract:
A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
Public/Granted literature
- US20190304870A1 MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL FOR MICROPROCESSOR THERMAL SOLUTIONS Public/Granted day:2019-10-03
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