COLD PLATE WITH INTEGRATED VAPOR CHAMBER

    公开(公告)号:US20210320048A1

    公开(公告)日:2021-10-14

    申请号:US17357792

    申请日:2021-06-24

    Abstract: A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.

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