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1.
公开(公告)号:US20190304870A1
公开(公告)日:2019-10-03
申请号:US15942270
申请日:2018-03-30
Applicant: Intel Corporation
Inventor: Thomas Boyd , Ming-Chen Chang , Evan A. Chenelly , Divya Swamy Bandaru , Craig J. Jahne , Andrew Larson , Eric W. Buddrius , Eric D. McAfee , Mustafa Haswarey , Ralph V. Miele , Rolf Laido
IPC: H01L23/40 , H05K7/14 , H01L23/367
Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
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公开(公告)号:US11557529B2
公开(公告)日:2023-01-17
申请号:US15942270
申请日:2018-03-30
Applicant: Intel Corporation
Inventor: Thomas Boyd , Ming-Chen Chang , Evan A. Chenelly , Divya Swamy Bandaru , Craig J. Jahne , Andrew Larson , Eric W. Buddrius , Eric D. McAfee , Mustafa Haswarey , Ralph V. Miele , Rolf Laido
IPC: H05K7/14 , H01L23/40 , H01L23/367
Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
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公开(公告)号:US20210320048A1
公开(公告)日:2021-10-14
申请号:US17357792
申请日:2021-06-24
Applicant: Intel Corporation
Inventor: Ameya Limaye , Evan A. Chenelly
IPC: H01L23/427 , H01L23/473 , H01L25/065 , H01L25/10
Abstract: A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.
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