Invention Grant
- Patent Title: Apparatus for lithographically forming wafer identification marks and alignment marks
-
Application No.: US16402574Application Date: 2019-05-03
-
Publication No.: US11562968B2Publication Date: 2023-01-24
- Inventor: Hu-Wei Lin , Chih-Hsien Hsu , Yu-Wei Chiu , Hai-Yin Chen , Ying-Hao Wang , Yu-Hen Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: H01L23/544
- IPC: H01L23/544 ; G03F7/20 ; H01L21/027 ; H01L21/67 ; F21K9/00 ; G03F9/00 ; H01L21/308

Abstract:
The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.
Public/Granted literature
- US20190259710A1 APPARATUS FOR LITHOGRAPHICALLY FORMING WAFER IDENTIFICATION MARKS AND ALIGNMENT MARKS Public/Granted day:2019-08-22
Information query
IPC分类: