公开(公告)号：US10739682B2

公开(公告)日：2020-08-11

申请号：US16693900

申请日：2019-11-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  H01L21/02 ,  H01L33/00

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US10283457B2

公开(公告)日：2019-05-07

申请号：US16114567

申请日：2018-08-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  G03F7/20 ,  H01L21/027 ,  H01L21/308 ,  H01L21/67

Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.

公开(公告)号：US11562968B2

公开(公告)日：2023-01-24

申请号：US16402574

申请日：2019-05-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  F21K9/00 ,  G03F9/00 ,  H01L21/308

Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.

公开(公告)号：US20190259710A1

公开(公告)日：2019-08-22

申请号：US16402574

申请日：2019-05-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  H01L21/308 ,  G03F7/20 ,  H01L21/67 ,  H01L21/027

Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.

公开(公告)号：US10295909B2

公开(公告)日：2019-05-21

申请号：US15903879

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  H01L33/00 ,  H01L21/02

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US20240395571A1

公开(公告)日：2024-11-28

申请号：US18790969

申请日：2024-07-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Meng-Fu Shih ,  Hu-Wei Lin

IPC: H01L21/67 ,  H01L21/677

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

公开(公告)号：US20230377910A1

公开(公告)日：2023-11-23

申请号：US17751185

申请日：2022-05-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Meng-Fu Shih ,  Hu-Wei Lin

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67051 ,  H01L21/67121 ,  H01L21/67706 ,  H01L21/67742

Abstract: An apparatus for cleaning a package device is provided. The apparatus includes a package device loader; a package device unloader; a first cleaning area disposed between the package device loader and the package device unloader; and a conveyor. The conveyor includes a frame extending from the package device loader to the package device unloader and through the first cleaning area; and a belt wrapping the frame, wherein the belt includes a movable upper surface between the package device loader and the package device unloader, wherein the movable upper surface is configured to move relative to and over the frame, and a first distance between the movable upper surface and the frame in the first cleaning area increases in a direction from the package device loader to the package device unloader.

公开(公告)号：US20230351577A1

公开(公告)日：2023-11-02

申请号：US17730585

申请日：2022-04-27

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： I-Hsuan Chen ,  Ying-Hao Wang ,  Chien-Lung Chen ,  Chien-Chi Tzeng ,  Hu-Wei Lin

IPC: G01N21/95 ,  G01N1/44 ,  G01N35/00 ,  H04N5/372 ,  H01L21/66 ,  G06T7/00 ,  G06T7/70

CPC classification number: G06T7/0004 ,  G01N1/44 ,  G01N21/9501 ,  G01N35/00 ,  G06T7/70 ,  H01L22/12 ,  H04N5/372 ,  G01N2035/00346 ,  G06T2207/30148

Abstract: A method includes forming a package component, the package component comprising an integrated circuit die, attaching the package component to a package substrate; placing a heat spreader over the package component and the package substrate to form an integrated circuit package, wherein a height of the integrated circuit package is in a range from 2.5 mm to 6 mm, and performing a first automatic optical inspection (AOI) process on the integrated circuit package using an AOI apparatus to determine if the orientation and alignment of the heat spreader with regards to the package substrate is within specification, wherein the AOI apparatus comprises a lens that has a maximum depth of field that is greater than the height of the integrated circuit package, and wherein during the first AOI process the depth of field encompasses an entirety of the height of the integrated circuit package.

公开(公告)号：US20180366415A1

公开(公告)日：2018-12-20

申请号：US16114567

申请日：2018-08-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  H01L21/67 ,  H01L21/027 ,  G03F7/20 ,  H01L21/308

CPC classification number: H01L23/544 ,  G03F7/70141 ,  G03F7/70541 ,  H01L21/0274 ,  H01L21/3086 ,  H01L21/67282 ,  H01L2223/54426 ,  H01L2223/54433

Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.

公开(公告)号：US20200089120A1

公开(公告)日：2020-03-19

申请号：US16693900

申请日：2019-11-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  H01L33/00 ,  H01L21/02 ,  H01L21/68

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.