公开(公告)号：US10295909B2

公开(公告)日：2019-05-21

申请号：US15903879

申请日：2018-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  H01L33/00 ,  H01L21/02

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US20180366415A1

公开(公告)日：2018-12-20

申请号：US16114567

申请日：2018-08-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  H01L21/67 ,  H01L21/027 ,  G03F7/20 ,  H01L21/308

CPC classification number: H01L23/544 ,  G03F7/70141 ,  G03F7/70541 ,  H01L21/0274 ,  H01L21/3086 ,  H01L21/67282 ,  H01L2223/54426 ,  H01L2223/54433

Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.

公开(公告)号：US10739682B2

公开(公告)日：2020-08-11

申请号：US16693900

申请日：2019-11-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687 ,  H01L21/02 ,  H01L33/00

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US10283457B2

公开(公告)日：2019-05-07

申请号：US16114567

申请日：2018-08-28

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  G03F7/20 ,  H01L21/027 ,  H01L21/308 ,  H01L21/67

Abstract: The present disclosure relates a method of forming substrate identification marks. In some embodiments, the method may be performed by forming a photosensitive material over a substrate. A first type of electromagnetic radiation is selectively provided to the photosensitive material to expose a plurality of substrate identification marks within the photosensitive material, and a second type of electromagnetic radiation is selectively provided to the photosensitive material to expose one or more alignment marks within the photosensitive material. Exposed portions of the photosensitive material are removed to form a patterned photosensitive material. The substrate is etched according to the patterned photosensitive material to form recesses within the substrate that are defined by the plurality of substrate identification marks and the one or more alignment marks.

公开(公告)号：US11562968B2

公开(公告)日：2023-01-24

申请号：US16402574

申请日：2019-05-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  F21K9/00 ,  G03F9/00 ,  H01L21/308

Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.

公开(公告)号：US20190259710A1

公开(公告)日：2019-08-22

申请号：US16402574

申请日：2019-05-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L23/544 ,  H01L21/308 ,  G03F7/20 ,  H01L21/67 ,  H01L21/027

Abstract: The present disclosure relates a lithographic substrate marking tool. The tool includes a first electromagnetic radiation source disposed within a housing and configured to generate a first type of electromagnetic radiation. A radiation guide is configured to provide the first type of electromagnetic radiation to a photosensitive material over a substrate. A second electromagnetic radiation source is disposed within the housing and is configured to generate a second type of electromagnetic radiation that is provided to the photosensitive material.

公开(公告)号：US20200089120A1

公开(公告)日：2020-03-19

申请号：US16693900

申请日：2019-11-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  H01L33/00 ,  H01L21/02 ,  H01L21/68

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US10509323B2

公开(公告)日：2019-12-17

申请号：US16391521

申请日：2019-04-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L21/027 ,  H01L21/67 ,  H01L21/687 ,  H01L33/00 ,  H01L21/02 ,  H01L21/68

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US20190250513A1

公开(公告)日：2019-08-15

申请号：US16391521

申请日：2019-04-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ying-Hao Wang ,  Chia-Chi Chung ,  Han-Chih Chung ,  Yu-Xiang Lin ,  Yu-Shine Lin ,  Yu-Hen Wu ,  Han Wen Hsu

IPC: G03F7/20 ,  H01L33/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/02 ,  H01L21/027 ,  H01L21/68

Abstract: Various embodiments of the present application are directed towards an edge-exposure tool with a light emitting diode (LED), as well as a method for edge exposure using a LED. In some embodiments, the edge-exposure tool comprises a process chamber, a workpiece table, a LED, and a controller. The workpiece table is in the process chamber and is configured to support a workpiece covered by a photosensitive layer. The LED is in the process chamber and is configured to emit radiation towards the workpiece. A controller is configured to control the LED to expose an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to the radiation emitted by the LED. The edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer.

公开(公告)号：US10283456B2

公开(公告)日：2019-05-07

申请号：US15154181

申请日：2016-05-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hu-Wei Lin ,  Chih-Hsien Hsu ,  Yu-Wei Chiu ,  Hai-Yin Chen ,  Ying-Hao Wang ,  Yu-Hen Wu

IPC: H01L21/67 ,  H01L23/544 ,  G03F7/20 ,  H01L21/027 ,  H01L21/308

Abstract: In some embodiments, the present disclosure relates a lithographic substrate marking tool. The lithographic substrate marking tool has a first lithographic exposure tool arranged within a shared housing and configured to generate a first type of electromagnetic radiation during a plurality of exposures. A mobile reticle has a plurality of different reticle fields respectively configured to block a portion of the first type of electromagnetic radiation to expose a substrate identification mark within a photosensitive material overlying a semiconductor substrate. A transversal element is configured to move the mobile reticle so that separate ones of the plurality of reticle fields are exposed onto the photosensitive material during separate ones of the plurality of exposures. The mobile reticle therefore allows for different strings of substrate identification marks to be formed within the photoresistive material using a same reticle, thereby economically providing the benefits of lithographic substrate marking.