- 专利标题： Carrier substrate, laminate, and method for manufacturing electronic device
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申请号： US15835030申请日： 2017-12-07
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公开(公告)号： US11587958B2公开(公告)日： 2023-02-21
- 发明人: Kazutaka Ono , Takatoshi Yaoita , Reo Usui , Kenichi Ebata , Jun Akiyama
- 申请人： AGC Inc.
- 申请人地址： JP Chiyoda-ku
- 专利权人： AGC Inc.
- 当前专利权人： AGC Inc.
- 当前专利权人地址： JP Chiyoda-ku
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JPJP2015-134697 20150703
- 主分类号： H01L27/12
- IPC分类号： H01L27/12 ; B32B43/00 ; B32B17/00 ; B32B7/12 ; C03C3/091 ; H01L21/683 ; H01L29/786 ; B32B38/10 ; B32B7/06 ; C03C27/10 ; B32B17/06 ; G02F1/1341 ; G02F1/1335 ; G02F1/1368
摘要：
A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
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