公开(公告)号：US11587958B2

公开(公告)日：2023-02-21

申请号：US15835030

申请日：2017-12-07

Applicant: AGC Inc.

Inventor： Kazutaka Ono ,  Takatoshi Yaoita ,  Reo Usui ,  Kenichi Ebata ,  Jun Akiyama

IPC: H01L27/12 ,  B32B43/00 ,  B32B17/00 ,  B32B7/12 ,  C03C3/091 ,  H01L21/683 ,  H01L29/786 ,  B32B38/10 ,  B32B7/06 ,  C03C27/10 ,  B32B17/06 ,  G02F1/1341 ,  G02F1/1335 ,  G02F1/1368

Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

公开(公告)号：US20240100915A1

公开(公告)日：2024-03-28

申请号：US18528287

申请日：2023-12-04

Applicant: AGC Inc.

Inventor： Shunji UEDA ,  Kenichi Ebata ,  Yuta Akashi

IPC: B60J1/20 ,  B29C65/14 ,  B29C65/48

CPC classification number: B60J1/20 ,  B29C65/1416 ,  B29C65/4815

Abstract: A method of producing metal component-attached vehicle window glass includes disposing a metal component on a main surface of window glass via an adhesive, locally heating the metal component, and transferring heat from the metal component to the adhesive to heat and cure the adhesive.