Invention Grant
- Patent Title: Semiconductor device and method of manufacture
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Application No.: US17121385Application Date: 2020-12-14
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Publication No.: US11631746B2Publication Date: 2023-04-18
- Inventor: Yen-Ting Chen , Wei-Yang Lee , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L21/311 ; H01L21/764 ; H01L29/08

Abstract:
A semiconductor device including a gaseous spacer and a method for forming the same are disclosed. In an embodiment, a method includes forming a gate stack over a substrate; forming a first gate spacer on sidewalls of the gate stack; forming a second gate spacer over the first gate spacer; removing a portion of the second gate spacer, at least a portion of the second gate spacer remaining; removing the first gate spacer to form a first opening; and after removing the first gate spacer, removing the remaining portion of the second gate spacer through the first opening.
Public/Granted literature
- US20210126104A1 Semiconductor Device and Method of Manufacture Public/Granted day:2021-04-29
Information query
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