Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16282323Application Date: 2019-02-22
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Publication No.: US11631753B2Publication Date: 2023-04-18
- Inventor: Chung-Fu Chang , Kuan-Hung Chen , Guang-Yu Lo , Chun-Chia Chen , Chun-Tsen Lu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW108102399 20190122
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/51 ; H01L21/02 ; H01L21/28

Abstract:
A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a gate dielectric layer on the fin-shaped structure; forming a gate electrode on the fin-shaped structure; performing a nitridation process to implant ions into the gate dielectric layer adjacent to two sides of the gate electrode; and forming an epitaxial layer adjacent to two sides of the gate electrode.
Public/Granted literature
- US20200235227A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-07-23
Information query
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