Invention Grant
- Patent Title: Substrate processing apparatus with moving device for connecting and disconnecting heater electrodes and substrate processing method thereof
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Application No.: US16583590Application Date: 2019-09-26
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Publication No.: US11637035B2Publication Date: 2023-04-25
- Inventor: Satoshi Morita , Masami Akimoto , Katsuhiro Morikawa , Kouichi Mizunaga
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2018-182834 20180927,JPJP2019-063375 20190328
- Main IPC: H01L21/687
- IPC: H01L21/687 ; H01L21/67 ; H01L21/304 ; B08B3/04 ; H01L21/02
Abstract:
A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; an electric heater provided at the rotary table and configured to heat the substrate; a power receiving electrode provided at the rotary table and electrically connected to the electric heater; a power feeding electrode configured to be contacted with the power receiving electrode to supply a power to the electric heater via the power receiving electrode; an electrode moving device configured to connect and disconnect the power feeding electrode and the power receiving electrode relatively; a power feeder configured to supply the power to the power feeding electrode; a processing cup disposed to surround the rotary table; at least one processing liquid nozzle configured to supply a processing liquid onto the substrate; a processing liquid supply device configured to supply the processing liquid to the processing liquid nozzle; and a controller.
Information query
IPC分类:
