- Patent Title: Method and system for map-free inspection of semiconductor devices
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Application No.: US16996211Application Date: 2020-08-18
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Publication No.: US11651981B2Publication Date: 2023-05-16
- Inventor: Jiao-Rou Liao , Sheng-Hsiang Chuang , Cheng-Kang Hu , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H04N5/232 ; G01B11/14 ; G06T7/00 ; H04N5/225 ; H04N7/18

Abstract:
A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.
Public/Granted literature
- US20220059376A1 METHOD AND SYSTEM FOR MAP-FREE INSPECTION OF SEMICONDUCTOR DEVICES Public/Granted day:2022-02-24
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