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公开(公告)号:US11651981B2
公开(公告)日:2023-05-16
申请号:US16996211
申请日:2020-08-18
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Jiao-Rou Liao , Sheng-Hsiang Chuang , Cheng-Kang Hu , Hsu-Shui Liu , Jiun-Rong Pai , Shou-Wen Kuo
CPC classification number: H01L21/67288 , G01B11/14 , G06T7/001 , H04N5/2256 , H04N5/23299 , H04N7/183 , G06T2207/30148
Abstract: A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.
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公开(公告)号:US11120539B2
公开(公告)日:2021-09-14
申请号:US16204387
申请日:2018-11-29
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Sheng-Hsiang Chuang , Jiao-Rou Liao , Cheng-Kang Hu , Shou-Wen Kuo , Jiun-Rong Pai , Hsu-Shui Liu
Abstract: A method for scanning and analyzing a surface, the method comprising: receiving a piece of equipment with a target surface for inspection; receiving an input from a user; determining at least one scan parameter based on the user input; scanning the target surface using an optical detector in accordance with the at least one scan parameter; generating an image of the target surface; correcting the image of the target surface to remove at least one undesired feature to generate a corrected image based on the at least one scan parameter; and analyzing the corrected image to determine at least one geometric parameter of the target surface.
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