Invention Grant
- Patent Title: Substrate-less FinFET diode architectures with backside metal contact and subfin regions
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Application No.: US16447874Application Date: 2019-06-20
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Publication No.: US11652107B2Publication Date: 2023-05-16
- Inventor: Nicholas Thomson , Ayan Kar , Kalyan Kolluru , Nathan Jack , Rui Ma , Mark Bohr , Rishabh Mehandru , Halady Arpit Rao
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/12 ; H01L27/02 ; H01L21/84 ; H01L29/861

Abstract:
Embodiments include diode devices and transistor devices. A diode device includes a first fin region over a first conductive region and an insulator region, and a second fin region over a second conductive and insulator regions, where the second fin region is laterally adjacent to the first fin region, and the insulator region is between the first and second conductive regions. The diode device includes a first conductive via on the first conductive region, where the first conductive via is vertically adjacent to the first fin region, and a second conductive via on the second conductive region, where the second conductive via is vertically adjacent to the second fin region. The diode device may include conductive contacts, first portions on the first fin region, second portions on the second fin region, and gate electrodes between the first and second portions and the conductive contacts.
Information query
IPC分类: