Invention Grant
- Patent Title: 3D flash memory with annular channel structure and array layout thereof
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Application No.: US16784167Application Date: 2020-02-06
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Publication No.: US11678486B2Publication Date: 2023-06-13
- Inventor: Hang-Ting Lue , Wei-Chen Chen , Teng Hao Yeh , Guan-Ru Lee
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INIERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INIERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11565 ; H01L23/528 ; H01L21/02 ; H01L21/311 ; H01L29/51 ; H01L21/306 ; H01L21/28

Abstract:
Provided are a 3D flash memory and an array layout thereof. The 3D flash memory includes a gate stack structure, a annular channel pillar, a first source/drain pillar, a second source/drain pillar and a charge storage structure. The gate stack structure is disposed on a dielectric base and includes a plurality of gate layers electrically insulated from each other. The annular channel pillar is disposed on the dielectric base and penetrates through the gate stack structure. The first source/drain pillar and the second source/drain pillar are disposed on the dielectric base, are located within the channel pillar and penetrate through the gate stack structure. The first source/drain pillar and the second source/drain pillar are separated from each other and are each connected to the channel pillar. The charge storage structure is disposed between each of the plurality of gate layers and the channel pillar.
Public/Granted literature
- US20200381450A1 3D FLASH MEMORY AND ARRAY LAYOUT THEREOF Public/Granted day:2020-12-03
Information query
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