Invention Grant
- Patent Title: Formulations for advanced polishing pads
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Application No.: US16529884Application Date: 2019-08-02
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Publication No.: US11685014B2Publication Date: 2023-06-27
- Inventor: Sivapackia Ganapathiappan , Ankit Vora , Boyi Fu , Venkat Hariharan , Mayu Yamamura , Mario Cornejo , Igor Abramson , Mo Yang , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: B24B37/24
- IPC: B24B37/24 ; C08F283/00 ; B33Y10/00 ; B29C64/112 ; B33Y70/10 ; B29L31/00 ; B33Y80/00

Abstract:
Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
Public/Granted literature
- US20200070302A1 FORMULATIONS FOR ADVANCED POLISHING PADS Public/Granted day:2020-03-05
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