公开(公告)号：US11072050B2

公开(公告)日：2021-07-27

申请号：US16050442

申请日：2018-07-31

Applicant: Applied Materials, Inc.

Inventor： Boyi Fu ,  Sivapackia Ganapathiappan ,  Daniel Redfield ,  Rajeev Bajaj ,  Ashwin Chockalingam ,  Dominic J. Benvegnu ,  Mario Dagio Cornejo ,  Mayu Yamamura ,  Nag B. Patibandla ,  Ankit Vora

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24

Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

公开(公告)号：US11685014B2

公开(公告)日：2023-06-27

申请号：US16529884

申请日：2019-08-02

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Ankit Vora ,  Boyi Fu ,  Venkat Hariharan ,  Mayu Yamamura ,  Mario Cornejo ,  Igor Abramson ,  Mo Yang ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla

IPC: B24B37/24 ,  C08F283/00 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B29L31/00 ,  B33Y80/00

CPC classification number: B24B37/24 ,  B29C64/112 ,  B33Y10/00 ,  B33Y70/10 ,  C08F283/008 ,  B29L2031/736 ,  B33Y80/00

Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.

公开(公告)号：US10830756B2

公开(公告)日：2020-11-10

申请号：US16122171

申请日：2018-09-05

Applicant: Applied Materials, Inc.

Inventor： Ankit Vora ,  Kenichi Ohno ,  Philip Allan Kraus ,  Zohreh Hesabi ,  Joseph R. Johnson

IPC: G01N27/447 ,  G01N33/487 ,  B82B3/00 ,  B82B1/00 ,  B81C1/00

Abstract: Methods of manufacturing well-controlled nanopores using directed self-assembly and methods of manufacturing free-standing membranes using selective etching are disclosed. In one aspect, one or more nanopores are formed by directed self-assembly with block co-polymers to shrink the critical dimension of a feature which is then transferred to a thin film. In another aspect, a method includes providing a substrate having a thin film over a highly etchable layer thereof, forming one or more nanopores through the thin film over the highly etchable layer, for example, by a pore diameter reduction process, and then selectively removing a portion of the highly etchable layer under the one or more nanopores to form a thin, free-standing membrane.

公开(公告)号：US11826876B2

公开(公告)日：2023-11-28

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia Ganapathiappan ,  Boyi Fu ,  Ashwin Chockalingam ,  Ankit Vora ,  Daniel Redfield ,  Rajeev Bajaj ,  Nag B. Patibandla ,  Hou T. Ng ,  Sudhakar Madhusoodhanan

IPC: B24B37/22 ,  B24B37/24 ,  B33Y70/00 ,  B29C64/112 ,  B33Y10/00 ,  B24B37/26 ,  B24B7/22 ,  B22F10/14 ,  B33Y80/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58

CPC classification number: B24B7/22 ,  B22F10/14 ,  B24B37/24 ,  B24B37/26 ,  B29C64/112 ,  B33Y70/00 ,  B22F10/12 ,  B22F10/18 ,  B22F10/25 ,  B22F10/28 ,  B22F10/68 ,  B22F12/55 ,  B22F12/58 ,  B33Y10/00 ,  B33Y80/00 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/10

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.