Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US17499908Application Date: 2021-10-13
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Publication No.: US11721765B2Publication Date: 2023-08-08
- Inventor: Hajime Watakabe , Tomoyuki Ito , Toshihide Jinnai , Isao Suzumura , Akihiro Hanada , Ryo Onodera
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: JAPAN DISPLAY INC.
- Current Assignee: JAPAN DISPLAY INC.
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JP 2019022378 2019.02.12
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/786 ; H01L27/12 ; H01L29/24 ; H01L29/423 ; H01L29/49 ; H01L21/02 ; H01L21/426 ; H01L21/4757 ; H01L21/4763 ; H01L29/66 ; G02F1/1368

Abstract:
A semiconductor device includes thin film transistors each having an oxide semiconductor. The oxide semiconductor has a channel region, a drain region, a source region, and low concentration regions which are lower in impurity concentration than the drain region and the source region. The low concentration regions are located between the channel region and the drain region, and between the channel region and the source region. Each of the thin film transistors has a gate insulating film on the channel region and the low concentration regions, an aluminum oxide film on a first part of the gate insulating film, the first part being located on the channel region, and a gate electrode on the aluminum oxide film and a second part of the gate insulating film, the second part being located on the low concentration regions.
Public/Granted literature
- US20220029026A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2022-01-27
Information query
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