Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US17267503Application Date: 2019-07-26
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Publication No.: US11742232B2Publication Date: 2023-08-29
- Inventor: Yoshinori Ikeda , Shota Umezaki , Shigeru Moriyama , Ryo Yamamoto , Takashi Uno
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JP 18155715 2018.08.22
- International Application: PCT/JP2019/029499 2019.07.26
- International Announcement: WO2020/039849A 2020.02.27
- Date entered country: 2021-02-10
- Main IPC: H01L21/673
- IPC: H01L21/673 ; B08B3/10 ; H01L21/02 ; H01L21/67
Abstract:
A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).
Public/Granted literature
- US20210313209A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-10-07
Information query
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