公开(公告)号：US11742232B2

公开(公告)日：2023-08-29

申请号：US17267503

申请日：2019-07-26

Applicant: Tokyo Electron Limited

Inventor： Yoshinori Ikeda ,  Shota Umezaki ,  Shigeru Moriyama ,  Ryo Yamamoto ,  Takashi Uno

IPC: H01L21/673 ,  B08B3/10 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67393 ,  B08B3/10 ,  H01L21/02057 ,  H01L21/67028

Abstract: A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).