公开(公告)号：US11742232B2

公开(公告)日：2023-08-29

申请号：US17267503

申请日：2019-07-26

Applicant: Tokyo Electron Limited

Inventor： Yoshinori Ikeda ,  Shota Umezaki ,  Shigeru Moriyama ,  Ryo Yamamoto ,  Takashi Uno

IPC: H01L21/673 ,  B08B3/10 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/67393 ,  B08B3/10 ,  H01L21/02057 ,  H01L21/67028

Abstract: A substrate processing method according to an embodiment of the present disclosure includes a step of holding a substrate by a substrate holding unit (31) which is rotatable, a step of arranging a top plate portion (41) above the substrate, a step of supplying a processing liquid to the substrate, and a step of supplying a rinsing liquid (Lr) between the substrate and the top plate portion (41) to wash the substrate and the top plate portion (41) with the rinsing liquid (Lr).

公开(公告)号：US11217451B2

公开(公告)日：2022-01-04

申请号：US16737526

申请日：2020-01-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hitoshi Kosugi ,  Shota Umezaki ,  Kouzou Tachibana ,  Ryo Yamamoto

IPC: H01L21/306 ,  H01L21/687 ,  H01L21/67

Abstract: A method includes rotating a substrate, supplying a first processing liquid from a first nozzle to the substrate during a first period, and supplying a second processing liquid from a second nozzle to the substrate during a second period. First and second liquid columns are formed by the first and second processing liquids during at least partially overlapped period of the first and second periods, respectively. The shapes and arrangements of the first and second liquid columns satisfy that: at least one of first and second central axis lines of the first and second liquid columns is inclined with respect to a rotational axis line of the substrate, first and second cut surfaces obtained by cutting the first and second liquid columns along a horizontal plane at least partially overlap each other, and any point on the first central axis line is located on the second central axis line.