Invention Grant
- Patent Title: Semiconductor device cleaning solution, method of use, and method of manufacture
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Application No.: US17172939Application Date: 2021-02-10
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Publication No.: US11773353B2Publication Date: 2023-10-03
- Inventor: Pinlei Edmund Chu , Chun-Wei Hsu , Ling-Fu Nieh , Chi-Jen Liu , Liang-Guang Chen , Yi-Sheng Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- The original application number of the division: US16152965 2018.10.05
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/302 ; B08B1/00 ; C11D11/00 ; C11D7/26 ; H01L21/321
Abstract:
A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.
Public/Granted literature
- US20210163859A1 Semiconductor Device Cleaning Solution, Method of Use, and Method of Manufacture Public/Granted day:2021-06-03
Information query
IPC分类:
