Invention Grant
- Patent Title: Semiconductor device package
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Application No.: US17404912Application Date: 2021-08-17
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Publication No.: US11776863B2Publication Date: 2023-10-03
- Inventor: Hao-Chih Hsieh , Tun-Ching Pi , Sung-Hung Chiang , Yu-Chang Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: FOLEY & LARDNER LLP
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/14 ; H01L23/498 ; H01L23/40
Abstract:
A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
Public/Granted literature
- US20210375706A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2021-12-02
Information query
IPC分类:
