Invention Grant
- Patent Title: Substrate treatment apparatus and method of performing treatment process on substrate
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Application No.: US16920418Application Date: 2020-07-02
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Publication No.: US11804371B2Publication Date: 2023-10-31
- Inventor: Do Yeon Kim , Se Hoon Oh , Won Geun Kim , Ju Mi Lee , Ho Jong Hwang , Pil Kyun Heo , Hyun Yoon , Choong Hyun Lee , Hyun Goo Park
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20190082284 2019.07.08
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; B05C11/08 ; G03F7/16
Abstract:
Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.
Public/Granted literature
- US20210013029A1 SUBSTRATE TREATMENT APPARATUS AND METHOD OF PERFORMING TREATMENT PROCESS ON SUBSTRATE Public/Granted day:2021-01-14
Information query
IPC分类:
