公开(公告)号：US20230213852A1

公开(公告)日：2023-07-06

申请号：US18148051

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Young Dae Chung ,  Hyun Yoon

IPC: G03F1/78 ,  G03F1/70

CPC classification number: G03F1/78 ,  G03F1/70

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.

公开(公告)号：US20250073742A1

公开(公告)日：2025-03-06

申请号：US18768390

申请日：2024-07-10

Applicant: SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Yeong Sung ,  Ki Hoon Choi ,  Seung Un Oh ,  Young Ho Park ,  Sang Hyeon Ryu ,  Jang Jin Lee ,  Hyun Yoon ,  Sang Gun Lee ,  Yu Jin Cho ,  Ho Jong Hwang ,  Jong Ju Park ,  Jong Keun Oh ,  Yong Woo Kim

IPC: B05C13/00 ,  G05B19/401 ,  G05B19/404 ,  G06T7/73

Abstract: Provided is a control device and a substrate processing apparatus including the same. The substrate processing apparatus includes a support unit configured to support and rotate a first substrate, the support unit including a spin chuck, a spray unit configured to spray a processing fluid on the first substrate, a correction unit on a swing arm and configured to irradiate a beam onto the first substrate when the processing fluid is provided on the first substrate, wherein the swing arm is adjacent to the spin chuck and is configured to move the correction unit to a target point on the first substrate, and a controller configured to control the spin chuck and the swing arm, and correct a position error of the swing arm using a second substrate, wherein a plurality of anchor patterns are on the second substrate.

公开(公告)号：US11887883B2

公开(公告)日：2024-01-30

申请号：US17341696

申请日：2021-06-08

Applicant: SEMES CO., LTD.

Inventor： Do Yeon Kim ,  Pil Kyun Heo ,  Ho Jong Hwang ,  Hyun Yoon ,  Jong Min Lee ,  Chul Gyun Baik

IPC: B32B3/00 ,  H01L21/687 ,  B29C45/00 ,  B29C45/16 ,  B29K507/04 ,  B29K27/18

CPC classification number: H01L21/68757 ,  B29C45/0001 ,  B29C45/0055 ,  B29C45/16 ,  H01L21/68721 ,  B29K2027/18 ,  B29K2507/04

Abstract: A heterogeneous composite material and a method for manufacturing the heterogeneous composite material are provided. The heterogeneous composite material includes a first compression structure formed by compressing a first material, and a second compression structure formed by compressing a second material different from the first material, and disposed in close contact with the first compression structure, wherein at least a portion of the first compression structure and at least a portion of the second compression structure are disposed on both sides of a boundary surface existing in a circular shape with a predetermined radius with respect to a central axis in a state in contact with each other at the boundary surface.

公开(公告)号：US20230229074A1

公开(公告)日：2023-07-20

申请号：US17899616

申请日：2022-08-31

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  In Ki Jung ,  Ki Hoon Choi ,  Tae Hee Kim ,  Se Hoon Oh

IPC: G03F1/72

CPC classification number: G03F1/72

Abstract: A photomask correction method capable of increasing the photomask precision is provided. The photomask correction method comprises measuring an intensity profile of a laser, acquiring etching amount data corresponding to the measured intensity profile using a library, determining a process parameter of the laser based on the etching amount data, and correcting a photomask with the laser according to the determined process parameter.

公开(公告)号：US20250065360A1

公开(公告)日：2025-02-27

申请号：US18768956

申请日：2024-07-10

Applicant: SEMES CO., LTD. ,  Samsung Electronics Co., Ltd.

Inventor： Jin Yeong Sung ,  Ki Hoon Choi ,  Seung Un Oh ,  Young Ho Park ,  Sang Hyeon Ryu ,  Jang Jin Lee ,  Hyun Yoon ,  Sang Gun Lee ,  Yu Jin Cho ,  Ho Jong Hwang ,  Jong Ju Park ,  Jong Keun Oh ,  Yong Woo Kim

IPC: B05C13/00 ,  G05B19/401 ,  G05B19/404 ,  G06T7/73

Abstract: A control device and a substrate processing apparatus including the same are provided. The substrate processing apparatus includes: a support unit including a spin head and configured to support and to rotate a substrate; a spraying unit configured to spray processing liquid onto the substrate; a correction unit in a swing arm, the correction unit configured to move to a target point on the substrate and to irradiate a beam when the processing liquid is sprayed onto the substrate; and a control unit configured to calculate the target point, wherein the control unit is configured to convert image coordinates associated with a first coordinate system and then to calculate the target point by converting the image coordinates associated with the first coordinate system into image coordinates associated with a second coordinate system, and the second coordinate system is based on rotation angles of the spin head and the swing arm.

公开(公告)号：US11960236B2

公开(公告)日：2024-04-16

申请号：US18084381

申请日：2022-12-19

Applicant: SEMES CO., LTD.

Inventor： Young Jun Son ,  Tae Hoon Lee ,  Hyun Yoon ,  Do Yeon Kim

IPC: G03G21/00 ,  G03G15/00 ,  G03G15/02 ,  G03G21/18

CPC classification number: G03G21/1842 ,  G03G15/0233 ,  G03G15/60 ,  G03G15/80 ,  G03G2215/0872 ,  G03G2221/0084 ,  G03G2221/1651

Abstract: Proposed are a home port and a substrate processing apparatus using the same. The home port is installed in the substrate processing apparatus to temporarily mount a nozzle for discharging a process liquid to a substrate, and includes a main body having a space therein, a nozzle holder provided at an upper portion of the main body and configured to mount the nozzle, an inclined surface formed below the nozzle holder in the space, a first supply pipe configured to discharge a rinse liquid to a tip of the nozzle, a second supply pipe configured to inject the rinse liquid into the main body, a conductive wire configured to electrically connect the inclined surface and the first supply pipe, and a first switch installed on the conductive wire.

公开(公告)号：US20230207324A1

公开(公告)日：2023-06-29

申请号：US18057321

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Won Sik Son ,  Hyun Yoon ,  Hyo Won Yang ,  Ji Hoon Jeong ,  Young Dae Chung ,  In Ki Jung

IPC: H01L21/268 ,  H01L21/67

CPC classification number: H01L21/268 ,  H01L21/6704 ,  H01L21/67115

Abstract: The present invention provides a substrate treating method of treating a substrate including a plurality of cells, the substrate treating method including: a liquid treating operation of supplying a treatment liquid to the substrate; and a heating operation of heating the substrate by supplying the treatment liquid and irradiating laser light to a specific region located outside a region in which the plurality of cells is provided, in which the laser light is formed to cover the specific region when viewed from the top.

公开(公告)号：US12046466B2

公开(公告)日：2024-07-23

申请号：US17965911

申请日：2022-10-14

Applicant: SEMES CO., LTD.

Inventor： Yong-Jun Seo ,  Hyun Yoon ,  Jungsuk Goh ,  Byeong Geun Kim ,  Yoonki Sa ,  Doyeon Kim ,  Yerim Yeon ,  Choonghyun Lee ,  Pil Kyun Heo ,  Youngje Um ,  Jaeseong Lee ,  Dongok Ahn

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/6715

Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.

公开(公告)号：US20230213876A1

公开(公告)日：2023-07-06

申请号：US18148127

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Young Ho Park ,  Tae Hee Kim ,  In Ki Jung ,  Kwang Sup Kim

IPC: G03F7/20 ,  G03F7/30 ,  G03F7/40

CPC classification number: G03F7/70683 ,  G03F7/2053 ,  G03F7/30 ,  G03F7/40 ,  G03F7/70025 ,  G03F7/7085 ,  G03F7/70825 ,  G03F1/72

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to rotate and support a substrate; a liquid supply unit configured to supply a liquid to the substrate supported on the support unit; and an optical module for heating the substrate supported on the support unit, and wherein the support unit includes a teaching member having a grid displaying a reference point which matches a center of the support unit.

公开(公告)号：US20230211436A1

公开(公告)日：2023-07-06

申请号：US18145245

申请日：2022-12-22

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  Ki Hoon Choi ,  In Ki Jung ,  Won Sik Son ,  Tae Hee Kim

IPC: B23K26/03 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/06 ,  B23K26/04 ,  B23K26/362

CPC classification number: B23K26/032 ,  G03F1/84 ,  G03F1/42 ,  G03F1/60 ,  B23K26/122 ,  B23K26/0648 ,  B23K26/043 ,  B23K26/362

Abstract: The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.