公开(公告)号：US20230229074A1

公开(公告)日：2023-07-20

申请号：US17899616

申请日：2022-08-31

Applicant: SEMES CO., LTD.

Inventor： Hyo Won YANG ,  Hyun Yoon ,  Ji Hoon Jeong ,  In Ki Jung ,  Ki Hoon Choi ,  Tae Hee Kim ,  Se Hoon Oh

IPC: G03F1/72

CPC classification number: G03F1/72

Abstract: A photomask correction method capable of increasing the photomask precision is provided. The photomask correction method comprises measuring an intensity profile of a laser, acquiring etching amount data corresponding to the measured intensity profile using a library, determining a process parameter of the laser based on the etching amount data, and correcting a photomask with the laser according to the determined process parameter.

公开(公告)号：US20230166285A1

公开(公告)日：2023-06-01

申请号：US18060030

申请日：2022-11-30

Applicant: SEMES CO., LTD.

Inventor： Yun Sang Kim ,  Yoon Seok Choi ,  Young Dae Chung ,  Soon-Cheon Cho ,  Se Hoon Oh

IPC: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80

CPC classification number: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80 ,  H05B2206/04

Abstract: Provided are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a chamber for providing a processing space; a substrate support unit provided in the processing space to support a substrate and rotate the substrate; a liquid supply unit including a chemical liquid discharge nozzle that discharges a chemical liquid to the substrate supported by the substrate support unit; and a microwave applying member for emitting microwaves to the substrate.

公开(公告)号：US12094733B2

公开(公告)日：2024-09-17

申请号：US17073342

申请日：2020-10-17

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Se Hoon Oh ,  Pil Kyun Heo ,  Hyun Goo Park

IPC: H01L21/67 ,  H01L21/306 ,  C09K13/04

CPC classification number: H01L21/6708 ,  H01L21/30604 ,  H01L21/67115 ,  C09K13/04

Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.

公开(公告)号：US11804371B2

公开(公告)日：2023-10-31

申请号：US16920418

申请日：2020-07-02

Applicant: SEMES CO., LTD.

Inventor： Do Yeon Kim ,  Se Hoon Oh ,  Won Geun Kim ,  Ju Mi Lee ,  Ho Jong Hwang ,  Pil Kyun Heo ,  Hyun Yoon ,  Choong Hyun Lee ,  Hyun Goo Park

IPC: H01L21/02 ,  H01L21/67 ,  B05C11/08 ,  G03F7/16

CPC classification number: H01L21/02057 ,  H01L21/6715 ,  B05C11/08 ,  G03F7/162 ,  H01L21/02282 ,  H01L21/67051

Abstract: Provided is a substrate treatment apparatus including a treatment container equipped with a conductive member. The conductive member is made of a material having a lower resistivity than that of the treatment container. The conductive member prevents a rise of an electric potential of the treatment container, which is caused by charging during treatment of a substrate, thereby preventing the substrate from being contaminated and damaged by particles and electrostatic arcing.