- 专利标题： Integrated circuit structures in package substrates
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申请号： US17379724申请日： 2021-07-19
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公开(公告)号： US11804426B2公开(公告)日： 2023-10-31
- 发明人: Sanka Ganesan , William James Lambert , Zhichao Zhang , Sri Chaitra Jyotsna Chavali , Stephen Andrew Smith , Michael James Hill , Zhenguo Jiang
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Akona IP
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/498 ; H01L21/48 ; H05K1/18 ; H01L23/00 ; H01L25/10 ; H01L25/065 ; H05K7/02 ; H01L21/56
摘要：
Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.
公开/授权文献
- US20210351116A1 INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES 公开/授权日：2021-11-11
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