公开(公告)号：US11107757B2

公开(公告)日：2021-08-31

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/31 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20200251411A1

公开(公告)日：2020-08-06

申请号：US16855629

申请日：2020-04-22

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/56 ,  H05K7/02 ,  H01L25/065 ,  H01L25/10 ,  H01L23/00 ,  H05K1/18 ,  H01L21/48 ,  H01L23/31

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US11804426B2

公开(公告)日：2023-10-31

申请号：US17379724

申请日：2021-07-19

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

CPC classification number: H01L23/49816 ,  H01L21/4832 ,  H01L21/4853 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H05K1/181 ,  H05K7/023

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20210351116A1

公开(公告)日：2021-11-11

申请号：US17379724

申请日：2021-07-19

Applicant: Intel Corporation

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H05K1/18 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20200091053A1

公开(公告)日：2020-03-19

申请号：US16131511

申请日：2018-09-14

Applicant: Intel Corporation

Inventor： Sameer Paital ,  Srinivas V. Pietambaram ,  Yonggang Li ,  Kristof Kuwawi Darmawikarta ,  Gang Duan ,  Krishna Bharath ,  Michael James Hill

IPC: H01L23/498 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H05K1/18

Abstract: Disclosed herein are integrated circuit (IC) package supports having inductors with magnetic material therein. For example, in some embodiments, an IC package support may include an inductor including a solenoid, a first portion of a magnetic material in an interior of the solenoid, and a second portion of magnetic material outside the interior of the solenoid.

公开(公告)号：US10672693B2

公开(公告)日：2020-06-02

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H05K1/18 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H01L21/56

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

公开(公告)号：US20190304887A1

公开(公告)日：2019-10-03

申请号：US15944728

申请日：2018-04-03

Applicant: INTEL CORPORATION

Inventor： Sanka Ganesan ,  William James Lambert ,  Zhichao Zhang ,  Sri Chaitra Jyotsna Chavali ,  Stephen Andrew Smith ,  Michael James Hill ,  Zhenguo Jiang

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H05K7/02 ,  H05K1/18

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.