- Patent Title: Electronic device having an oxygen free platinum group metal film
-
Application No.: US17955996Application Date: 2022-09-29
-
Publication No.: US11894233B2Publication Date: 2024-02-06
- Inventor: Yixiong Yang , Wei V. Tang , Seshadri Ganguli , Sang Ho Yu , Feng Q. Liu , Jeffrey W. Anthis , David Thompson , Jacqueline S. Wrench , Naomi Yoshida
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- The original application number of the division: US16549756 2019.08.23
- Main IPC: H01L21/285
- IPC: H01L21/285 ; C23C16/455 ; C23C16/18 ; H01L23/532 ; C23C16/04
Abstract:
Methods of depositing platinum group metal films of high purity, low resistivity, and good conformality are described. A platinum group metal film is formed in the absence of an oxidant. The platinum group metal film is selectively deposited on a conductive substrate at a temperature less than 200° C. by using an organic platinum group metal precursor.
Public/Granted literature
- US20230025937A1 Oxygen Free Deposition Of Platinum Group Metal Films Public/Granted day:2023-01-26
Information query
IPC分类:
