- 专利标题: Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer
-
申请号: US17030350申请日: 2020-09-23
-
公开(公告)号: US12051698B2公开(公告)日: 2024-07-30
- 发明人: Daniel G. Ouellette , Daniel B. O'Brien , Jeffrey S. Leib , Orb Acton , Lukas Baumgartel , Dan S. Lavric , Dax M. Crum , Oleg Golonzka , Tahir Ghani
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt P.C.
- 主分类号: H01L27/00
- IPC分类号: H01L27/00 ; H01L27/092 ; H01L29/06 ; H01L29/40 ; H01L29/423 ; H01L29/49 ; H01L29/51 ; H01L29/775
摘要:
Gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, the first gate stack having a P-type conductive layer on a first gate dielectric. The P-type conductive layer includes molybdenum and nitrogen. A second gate stack is over the second vertical arrangement of horizontal nanowires, the second gate stack having an N-type conductive layer on a second gate dielectric.
公开/授权文献
信息查询
IPC分类: