Invention Grant
- Patent Title: Laminate and method for producing same
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Application No.: US17614222Application Date: 2020-09-11
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Publication No.: US12116671B2Publication Date: 2024-10-15
- Inventor: Akira Furuya , Tadaaki Kojima , Hiroshi Suzuki
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 19186772 2019.10.10
- International Application: PCT/JP2020/034516 2020.09.11
- International Announcement: WO2021/070561A 2021.04.15
- Date entered country: 2021-11-24
- Main IPC: C23C18/16
- IPC: C23C18/16 ; B32B15/01 ; C23C18/44 ; C23C18/50 ; C23C28/02 ; C25D3/12 ; H01L21/687
Abstract:
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
Public/Granted literature
- US20220228266A1 LAMINATE AND METHOD FOR PRODUCING SAME Public/Granted day:2022-07-21
Information query
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