公开(公告)号：US12116671B2

公开(公告)日：2024-10-15

申请号：US17614222

申请日：2020-09-11

Applicant: SHOWA DENKO K.K.

Inventor： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki

IPC: C23C18/16 ,  B32B15/01 ,  C23C18/44 ,  C23C18/50 ,  C23C28/02 ,  C25D3/12 ,  H01L21/687

CPC classification number: C23C18/1651 ,  B32B15/015 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/44 ,  C23C18/50 ,  C23C28/021 ,  C25D3/12 ,  H01L21/68757

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US12031213B2

公开(公告)日：2024-07-09

申请号：US17595570

申请日：2020-07-09

Applicant: SHOWA DENKO K.K.

Inventor： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki ,  Fumiaki Naka

IPC: B32B15/01 ,  B32B3/10 ,  B32B3/26 ,  B32B3/30 ,  B32B15/04 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/16 ,  C23C18/18 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/00 ,  C23C28/02 ,  C23C30/00 ,  C25D3/12 ,  H01J37/32 ,  C22C38/44 ,  C23C16/44

CPC classification number: C23C28/322 ,  B32B3/10 ,  B32B3/266 ,  B32B3/30 ,  B32B15/01 ,  B32B15/015 ,  B32B15/017 ,  B32B15/018 ,  B32B15/04 ,  B32B15/043 ,  B32B15/18 ,  B32B15/20 ,  C23C8/12 ,  C23C8/14 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/1696 ,  C23C18/1848 ,  C23C18/32 ,  C23C18/34 ,  C23C18/36 ,  C23C18/42 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/02 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C23C28/321 ,  C23C28/345 ,  C23C30/00 ,  C23C30/005 ,  C25D3/12 ,  H01J37/32477 ,  C22C38/44 ,  C23C16/4404 ,  C23C18/1824 ,  Y10T428/1259 ,  Y10T428/12597 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/1266 ,  Y10T428/12667 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/12993 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/249953 ,  Y10T428/26 ,  Y10T428/265

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US12064937B2

公开(公告)日：2024-08-20

申请号：US17614172

申请日：2020-08-11

Applicant: SHOWA DENKO K.K.

Inventor： Akira Furuya ,  Tadaaki Kojima ,  Hiroshi Suzuki ,  Fumiaki Naka

IPC: B32B15/01 ,  C25D5/14 ,  C25D5/50

CPC classification number: B32B15/013 ,  B32B15/017 ,  B32B15/018 ,  C25D5/14 ,  C25D5/50

Abstract: A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.