Invention Grant
- Patent Title: Cleaning method and substrate processing apparatus
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Application No.: US17753004Application Date: 2020-08-06
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Publication No.: US12252786B2Publication Date: 2025-03-18
- Inventor: Yoshihiro Takezawa , Daisuke Suzuki , Hiroyuki Hayashi , Tatsuya Miyahara , Keisuke Fujita , Masami Oikawa , Sena Fujita
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP2019-150680 20190820
- International Application: PCT/JP2020/030214 WO 20200806
- International Announcement: WO2021/033568 WO 20210225
- Main IPC: B08B5/00
- IPC: B08B5/00 ; B08B9/08 ; B08B13/00 ; C23C16/44 ; H01L21/02

Abstract:
A cleaning method according to an aspect of the present disclosure includes: supplying a halogen-containing gas that does not contain fluorine to an interior of a processing container that is capable of being exhausted via an exhaust pipe to perform a cleaning; and supplying a fluorine-containing gas to at least one of the interior of the processing container and an interior of the exhaust pipe to perform the cleaning after the supplying the halogen-containing gas to perform the cleaning.
Public/Granted literature
- US20220364228A1 CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-11-17
Information query
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