Invention Grant
- Patent Title: Apparatus and method for CMP temperature control
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Application No.: US16989734Application Date: 2020-08-10
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Publication No.: US12296427B2Publication Date: 2025-05-13
- Inventor: Haosheng Wu , Shou-Sung Chang , Chih Chung Chou , Jianshe Tang , Hui Chen , Hari Soundararajan , Brian J. Brown
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24B37/015
- IPC: B24B37/015 ; B24B57/02 ; H01L21/321 ; H01L21/67
Abstract:
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.
Public/Granted literature
- US20210046604A1 APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL Public/Granted day:2021-02-18
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