- Patent Title: Slurry composition and method for polishing and integrated circuit
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Application No.: US17141988Application Date: 2021-01-05
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Publication No.: US12297375B2Publication Date: 2025-05-13
- Inventor: Ji Cui , Chi-Jen Liu , Liang-Guang Chen , Kei-Wei Chen , Chun-Wei Hsu , Li-Chieh Wu , Peng-Chung Jangjian , Kao-Feng Liao , Fu-Ming Huang , Wei-Wei Liang , Tang-Kuei Chang , Hui-Chi Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: C09G1/02
- IPC: C09G1/02 ; H01L21/321 ; H01L21/768 ; H01L23/535
Abstract:
A slurry composition, a polishing method and an integrated circuit are provided. The slurry composition includes a slurry and at least one rheology modifier. The slurry includes at least one liquid carrier, at least one abrasives and at least one oxidizer. The rheology modifier is dispensed in the slurry. The polishing method includes using the slurry composition with the rheology modifier to polish a conductive layer.
Public/Granted literature
- US20210371702A1 SLURRY COMPOSITION AND METHOD FOR POLISHING AND INTEGRATGED CIRCUIT Public/Granted day:2021-12-02
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