Invention Application
- Patent Title: Apparatus and method for electro chemical deposition
- Patent Title (中): 电化学沉积的装置和方法
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Application No.: US10217872Application Date: 2002-08-13
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Publication No.: US20030000841A1Publication Date: 2003-01-02
- Inventor: Joseph J. Stevens , Yevgeniy Rabinovich , Sandy S. Chao , Mark R. Denome , Allen L. D'Ambra , Donald J. Olgado
- Applicant: Applied Materials, Inc.
- Applicant Address: null
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: null
- Main IPC: C25D021/12
- IPC: C25D021/12 ; C25C003/16 ; C25C003/20 ; C25B009/00 ; C25B015/00 ; C25D003/38 ; B23H003/02 ; B23H007/14 ; H01L021/445 ; H01L021/288 ; B23H007/04 ; C25F007/00 ; C25D017/00 ; C25B009/04 ; C25D005/02 ; C25D005/00
Abstract:
A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.
Public/Granted literature
- US07005046B2 Apparatus for electro chemical deposition Public/Granted day:2006-02-28
Information query
