公开(公告)号：US20020029961A1

公开(公告)日：2002-03-14

申请号：US09867780

申请日：2001-05-29

Applicant: Applied Materials, Inc.

Inventor： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Anna Marie Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

IPC: C25D017/00 ,  C25D007/12 ,  C25D021/12

CPC classification number: H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H05K3/241

Abstract: The present invention provides an electrochemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electrochemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electrochemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electrochemical deposition process and the components of the electrochemical deposition system.

Abstract translation: 本发明提供一种电化学沉积系统，其被设计成具有可扩展以适应未来设计和间隙填充要求的柔性结构，并且提供令人满意的生产量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机，与主机连接设置的加载站，与主机连接设置的一个或多个处理单元和流体连接到该一个或多个电处理 细胞。 优选地，电化学沉积系统包括设置在加载站和主机之间的旋转干燥（SRD）站，附接到装载站的快速热退火室，以及用于控制电化学沉积过程和组件的系统控制器 的电化学沉积系统。

公开(公告)号：US20040084301A1

公开(公告)日：2004-05-06

申请号：US10690033

申请日：2003-10-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Yezdi Dordi ,  Donald J. Olgado ,  Ratson Morad ,  Peter Hey ,  Mark Denome ,  Michael Sugarman ,  Mark Lloyd ,  Anna Marie Lloyd ,  Joseph Stevens ,  Dan Marohl ,  Ho Seon Shin ,  Eugene Ravinovich ,  Robin Cheung ,  Ashok K. Sinha ,  Avi Tepman ,  Dan Carl ,  George Birkmaier

IPC: C25D017/00

CPC classification number: H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/67745 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H05K3/241

Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Abstract translation: 本发明提供了一种电化学沉积系统，其被设计成具有可扩展以适应未来设计和间隙填充要求的柔性结构，并提供令人满意的生产量以满足其它处理系统的需求。 电化学沉积系统通常包括具有主机晶片传送机器人的主机，与主机连接设置的加载站，与主机连接设置的一个或多个处理单元，以及流体连接到该主机的一个或多个 电加工电池。 优选地，电化学沉积系统包括设置在加载站和主机之间的旋转干燥（SRD）站，附接到装载站的快速热退火室，以及用于控制电化学沉积的系统控制器 工艺和电化学沉积系统的组件。

公开(公告)号：US20030000841A1

公开(公告)日：2003-01-02

申请号：US10217872

申请日：2002-08-13

Applicant: Applied Materials, Inc.

Inventor： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

IPC: C25D021/12 ,  C25C003/16 ,  C25C003/20 ,  C25B009/00 ,  C25B015/00 ,  C25D003/38 ,  B23H003/02 ,  B23H007/14 ,  H01L021/445 ,  H01L021/288 ,  B23H007/04 ,  C25F007/00 ,  C25D017/00 ,  C25B009/04 ,  C25D005/02 ,  C25D005/00

CPC classification number: C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D21/18

Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Abstract translation: 提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。

公开(公告)号：US20020066664A1

公开(公告)日：2002-06-06

申请号：US10039808

申请日：2001-10-26

Applicant: Applied Materials, Inc.

Inventor： Shamouil Shamouilian ,  Anada H. Kumar ,  Donald J. Olgado ,  Joseph J. Stevens ,  Ricardo Leon ,  Jon Clinton

IPC: B23H003/02

CPC classification number: H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12

Abstract: The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

Abstract translation: 本发明涉及向基板供电的装置。 在一个实施例中，该装置包括多个触点，电流传感器和电流调节器。 电流传感器附接到多个触点中的每一个以感测其电流。 电流调节器响应于电流传感器控制施加到多个触点中的每一个的电流。 在另一个实施例中，围绕每个接触件的周边形成柔顺脊，以将接触件密封到不期望的化学物质上。