发明申请
- 专利标题： Package for semiconductor devices
- 专利标题（中）： 半导体器件封装
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申请号： US10855979申请日： 2004-05-28
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公开(公告)号： US20050006744A1公开(公告)日： 2005-01-13
- 发明人: Kazuhiko Ooi , Tadashi Kodaira , Eisaku Watari , Jyunichi Nakamura , Shunichiro Matsumoto
- 申请人： Kazuhiko Ooi , Tadashi Kodaira , Eisaku Watari , Jyunichi Nakamura , Shunichiro Matsumoto
- 申请人地址： JP Nagano
- 专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人： SHINKO ELECTRIC INDUSTRIES CO., LTD.
- 当前专利权人地址： JP Nagano
- 优先权： JP2003-155333(PAT. 20030530
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/44 ; H01L23/14 ; H01L23/32 ; H01L23/498 ; H05K1/00 ; H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K3/46
摘要：
To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. A package for semiconductor devices is formed as a laminate (20) of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole regions or some regions of the insulating resin layers (20d to 20f) of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
公开/授权文献
- US07285856B2 Package for semiconductor devices 公开/授权日：2007-10-23