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    Pad structure of wiring board and wiring board
    2.
    发明申请
    Pad structure of wiring board and wiring board 审中-公开
    接线板和接线板的焊盘结构

    公开(公告)号：US20060209497A1

    公开(公告)日：2006-09-21

    申请号：US10549079

    申请日：2004-09-21

    申请人： Kazuhiko Ooi ,  Kenjiro Enoki ,  Sachiko Oda

    发明人： Kazuhiko Ooi ,  Kenjiro Enoki ,  Sachiko Oda

    IPC分类号： H02B1/00

    CPC分类号： H05K3/244 ,  C23C18/1651 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2203/072 ,  H01L2924/00

    摘要： A pad structure for a circuit board including a phosphorus-containing nickel layer is provided, capable of improving a tensile strength of a solder member such as a solder ball mounted thereon or a foreign member soldered thereto. The pad structure (40) is a multi-layer plated structure provided in a conductor pattern of the substrate, for mounting the solder bump (20) thereon, and formed as part of the conductor pattern, including a metal layer (10) formed as part of the conductor pattern to constitute a pad body, a phosphorus-containing nickel layer (12) formed by an electroless nickel plating to be directly brought into contact with the metal layer, a copper layer (14) thinner than the nickel layer, formed on the nickel layer by an electroless copper plating, and a precious metal layer (16) formed on the copper layer by an electroless precious metal plating.

    摘要翻译： 提供了一种用于包括含磷镍层的电路板的焊盘结构，其能够提高焊接部件（例如安装在其上的焊球）或焊接的外部部件的抗拉强度。 衬垫结构（40）是设置在衬底的导体图案中的多层电镀结构，用于将焊料凸块（20）安装在其上，并形成为导体图案的一部分，包括金属层（10），其形成为 构成衬垫体的导体图案的一部分，通过化学镀镍形成的含磷镍层（12）与金属层直接接触，形成比镍层薄的铜层（14） 通过化学镀铜在镍层上，通过无电镀贵金属镀在铜层上形成的贵金属层（16）。

    Metal core substrate and process for manufacturing same
    3.
    发明授权
    Metal core substrate and process for manufacturing same 有权
    金属芯基板及其制造方法

    公开(公告)号：US06767616B2

    公开(公告)日：2004-07-27

    申请号：US10436143

    申请日：2003-05-13

    申请人： Kazuhiko Ooi ,  Masaru Yamazaki ,  Yukiji Watanabe ,  Takaaki Yazawa

    发明人： Kazuhiko Ooi ,  Masaru Yamazaki ,  Yukiji Watanabe ,  Takaaki Yazawa

    IPC分类号： B32B300

    CPC分类号： H05K3/44 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/09518 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09718 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/09845 ,  Y10S428/901 ,  Y10T428/24917

    摘要： A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43). The second metal plate (12) is electrically connected with the second wiring pattern (46) and the first wiring pattern (45), respectively, by means of a via (42) and by means a via (41), respectively.

    摘要翻译： 金属芯基板包括由第一和第二金属板（11,12）组成的芯层（10），第一和第二金属板与第三绝缘层（13）分开; 分别形成在第一和金属板上的第一和第二绝缘层（20,21）; 分别形成在第一和第二绝缘层上的第一和第二布线图案（45,46）。 形成在通孔（22）中的导电层（40）穿过第一绝缘层，第一金属板，第三绝缘层，第二金属板和第二绝缘层，用于将第一布线图案与第二绝缘层 接线图案。 第一金属板（11）通过通孔（44）和通孔（43）分别与第一布线图案（45）和第二布线图案（46）电连接。 第二金属板（12）分别通过通孔（42）和通孔（41）与第二布线图案（46）和第一布线图案（45）电连接。