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公开(公告)号:US20100155933A1
公开(公告)日:2010-06-24
申请号:US12659081
申请日:2010-02-24
IPC分类号: H01L23/48
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
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公开(公告)号:US20050006744A1
公开(公告)日:2005-01-13
申请号:US10855979
申请日:2004-05-28
IPC分类号: H01L23/12 , H01L21/44 , H01L23/14 , H01L23/32 , H01L23/498 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/11 , H05K3/46
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. A package for semiconductor devices is formed as a laminate (20) of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole regions or some regions of the insulating resin layers (20d to 20f) of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
摘要翻译: 为了防止在半导体元件和安装半导体元件的半导体封装之间的接合部分中产生应力,使得即使安装具有小强度的半导体元件也不会发生裂纹。 半导体器件用封装形成为具有交替层叠的多个导电层和绝缘树脂层的多层的叠层体(20),在叠层体的一个面上具有用于安装半导体元件的部分 。 层叠体的绝缘树脂层(20d〜20f)的整个区域或部分区域至少包括半导体元件的安装部分及其周边部分,由浸渍有液晶的机织织物 聚合物与绝缘树脂。
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公开(公告)号:US20100155114A1
公开(公告)日:2010-06-24
申请号:US12659080
申请日:2010-02-24
IPC分类号: H05K1/03
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
摘要翻译: 为了防止或减轻用于安装半导体元件的半导体元件和半导体封装之间的接合部分中的应力的发生,使得即使安装具有低强度的半导体元件也不会发生裂纹。 半导体器件的封装形成为包括多个导电层和绝缘树脂层的多层的叠层,所述多个导电层和绝缘树脂层彼此交替层叠,并且在层叠体的一个表面上具有用于安装半导体元件的部分。 至少包括用于安装半导体元件的部分和其周边的层压体的绝缘树脂层的整个区域或某些区域由通过浸渍液晶聚合物的织物而获得的预浸料 绝缘树脂。
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公开(公告)号:US20080042258A1
公开(公告)日:2008-02-21
申请号:US11892927
申请日:2007-08-28
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
摘要翻译: 为了防止或减轻用于安装半导体元件的半导体元件和半导体封装之间的接合部分中的应力的发生,使得即使安装具有低强度的半导体元件也不会发生裂纹。 半导体器件的封装形成为包括多个导电层和绝缘树脂层的多层的叠层,所述多个导电层和绝缘树脂层彼此交替层叠,并且在层叠体的一个表面上具有用于安装半导体元件的部分。 至少包括用于安装半导体元件的部分和其周边的层压体的绝缘树脂层的整个区域或某些区域由通过浸渍液晶聚合物的织物而获得的预浸料 绝缘树脂。
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公开(公告)号:US07696617B2
公开(公告)日:2010-04-13
申请号:US11892927
申请日:2007-08-28
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
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公开(公告)号:US07285856B2
公开(公告)日:2007-10-23
申请号:US10855979
申请日:2004-05-28
IPC分类号: H05K3/46
CPC分类号: H05K3/4688 , H01L23/145 , H01L23/49822 , H01L2224/16 , H01L2924/01078 , H01L2924/12044 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15311 , H05K1/0271 , H05K1/0366 , H05K2201/0133 , H05K2201/0141 , H05K2201/0278 , H05K2201/029 , H05K2201/068 , H05K2201/09036 , H05K2201/10674
摘要: To prevent the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a small strength. A package for semiconductor devices is formed as a laminate (20) of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole regions or some regions of the insulating resin layers (20d to 20f) of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
摘要翻译: 为了防止在半导体元件和安装半导体元件的半导体封装之间的接合部分中产生应力,使得即使安装具有小强度的半导体元件也不会发生裂纹。 半导体器件用封装形成为具有交替层叠的多个导电层和绝缘树脂层的多层的叠层体(20),在叠层体的一个面上具有用于安装半导体元件的部分 。 至少包括用于安装半导体元件的部分及其周边的层压体的绝缘树脂层(20d至20f)的整个区域或一些区域由通过浸渍 具有绝缘树脂的液晶聚合物。
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