发明申请
- 专利标题： Apparatus and method for mounting electronic components
- 专利标题（中）： 用于安装电子部件的装置和方法
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申请号： US10324001申请日： 2002-12-20
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公开(公告)号： US20050098610A1公开(公告)日： 2005-05-12
- 发明人: Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
- 申请人： Shunji Onobori , Shuichi Hirata , Masakazu Yamano , Kazuya Yamamoto , Satoshi Shida , Takaharu Mae , Makoto Akita , Shozo Minamitani
- 优先权： JP2001-194896 20010627; JP2001-213512 20010713
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; H01L21/56 ; H01L21/60 ; H05K3/34 ; B23K31/02
摘要：
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.
公开/授权文献
- US07296727B2 Apparatus and method for mounting electronic components 公开/授权日：2007-11-20