公开(公告)号：US07296727B2

公开(公告)日：2007-11-20

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US20050098610A1

公开(公告)日：2005-05-12

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K1/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US20050227429A1

公开(公告)日：2005-10-13

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K20/10 ,  H01L21/00 ,  H01L21/8238

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US07861908B2

公开(公告)日：2011-01-04

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US20070187457A1

公开(公告)日：2007-08-16

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US07229854B2

公开(公告)日：2007-06-12

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US20060102701A1

公开(公告)日：2006-05-18

申请号：US11317146

申请日：2005-12-27

申请人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

发明人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

IPC分类号： B23K31/02 ,  B23Q15/00 ,  B23K13/08 ,  B23K31/00

CPC分类号： H01L23/544 ,  B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

公开(公告)号：US06329640B1

公开(公告)日：2001-12-11

申请号：US09690746

申请日：2000-10-18

申请人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

发明人： Shoriki Narita ,  Makoto Imanishi ,  Takaharu Mae ,  Nobuhisa Watanabe ,  Shinji Kanayama

IPC分类号： F27B514

CPC分类号： H01L21/67103 ,  H01L21/68

摘要： An object of the present invention is to provide a bump-bonding heating apparatus, a bump bonding method and a bump forming apparatus which do not involve large-sized apparatus configuration and which are easy to handle, and a semiconductor wafer in which bumps are formed by using the bump bonding method. The bump-bonding heating apparatus has a wafer turning member, a turning unit and a wafer heating unit. The turning member is turned by the turning unit without turning the wafer heating unit, whereby a semiconductor wafer mounted on the turning member is turned. Like this, since the wafer heating unit is not turned, the apparatus configuration can be made compact. Since the turning member is turned directly by the turning unit, the turning angle of the semiconductor wafer can be implemented with higher precision as compared with the conventional gas floating type turning method.

摘要翻译： 本发明的目的是提供一种不涉及大型装置结构并易于处理的凸块焊接加热装置，凸块接合方法和凸块形成装置以及形成凸块的半导体晶片 通过使用凸块接合方法。 凸点焊接加热装置具有晶片转动部件，转动部件和晶片加热部件。 转动构件在不转动晶片加热单元的情况下由转动单元转动，从而转动安装在转动构件上的半导体晶片。 像这样，由于晶片加热单元没有转动，所以可以使装置结构紧凑。 由于转动构件直接由转动单元转动，与常规气浮式转动方法相比，可以以更高的精度实现半导体晶片的转动角度。

公开(公告)号：US20080179378A1

公开(公告)日：2008-07-31

申请号：US11980565

申请日：2007-10-31

申请人： Makoto Imanishi ,  Shoriki Narita ,  Masahiko Ikeya ,  Shinji Kanayama ,  Takaharu Mae

发明人： Makoto Imanishi ,  Shoriki Narita ,  Masahiko Ikeya ,  Shinji Kanayama ,  Takaharu Mae

IPC分类号： B23K37/00

CPC分类号： H01L21/67288 ,  H01L21/67144 ,  H01L21/67248 ,  H01L2924/0002 ,  H01L2924/00

摘要： A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

公开(公告)号：US07052984B2

公开(公告)日：2006-05-30

申请号：US10415587

申请日：2001-11-16

申请人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

发明人： Shoriki Narita ,  Masahiko Ikeya ,  Yasutaka Tsuboi ,  Takaharu Mae ,  Shinji Kanayama

IPC分类号： H01L21/44

CPC分类号： H01L23/544 ,  B23K20/007 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/54453 ,  H01L2223/54473 ,  H01L2223/5448 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.