公开(公告)号：US07296727B2

公开(公告)日：2007-11-20

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US20050098610A1

公开(公告)日：2005-05-12

申请号：US10324001

申请日：2002-12-20

申请人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

发明人： Shunji Onobori ,  Shuichi Hirata ,  Masakazu Yamano ,  Kazuya Yamamoto ,  Satoshi Shida ,  Takaharu Mae ,  Makoto Akita ,  Shozo Minamitani

IPC分类号： B23K1/00 ,  H01L21/56 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/563 ,  H01L24/75 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/751 ,  H01L2224/7515 ,  H01L2224/75301 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/758 ,  H01L2224/7598 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10151 ,  H05K2203/0195 ,  H05K2203/082 ,  Y02P70/613 ,  H01L2224/05599

摘要： After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.

摘要翻译： 在检测到由头工具的吸嘴吸引并保持的电子部件的各个焊料凸块之间的接触以及电路板的各个焊接部分之后，焊料凸块和焊料部分通过加热而熔化。 执行电子部件从头部工具的吸嘴吸引和保持的释放，而不是在焊料熔化期间，而是在焊料熔化，冷却和固化之后的时间。 因此，提供了能够安装具有窄凸起的高端电子部件的电子部件安装方法和装置。

公开(公告)号：US20050227429A1

公开(公告)日：2005-10-13

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K20/10 ,  H01L21/00 ,  H01L21/8238

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US07861908B2

公开(公告)日：2011-01-04

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US20070187457A1

公开(公告)日：2007-08-16

申请号：US11731312

申请日：2007-03-30

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

摘要翻译： 部件安装装置包括：部件供给器，其部件的凸起电极朝下，将该部件安装在基板上的安装头，固定基板的支撑基座以及将部件与基板对准的定位装置。 安装头包括：超声波振动发生器，将由超声波振动发生器提供的超声波的振动传递给保持部件的工作面与振动平行的超声波振动传播部件;压力加载器，其对工作面施加压力负荷; 在其上方垂直于其上方的位置，以及加热工作面附近的加热器。 因此，即使在其表面上具有多个凸块电极，也可以高可靠性地进行超声波接合。

公开(公告)号：US07229854B2

公开(公告)日：2007-06-12

申请号：US10508460

申请日：2003-03-27

申请人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

发明人： Shozo Minamitani ,  Takaharu Mae ,  Yasuharu Ueno ,  Akira Yamada ,  Shinji Kanayama ,  Makoto Akita ,  Nobuhisa Watanabe ,  Akira Mori ,  Hiroyuki Naito ,  Shinya Marumo ,  Makoto Morikawa

IPC分类号： H01L21/50

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75355 ,  H01L2224/75743 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81222 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A component mounting apparatus includes a component feeder (20) that feeds a component (2) with its bump electrodes facing down, a mounting head (5) that mounts the component onto a substrate (3), a supporting base (8) that secures the substrate, and a positioning device (6, 7) that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (24), an ultrasonic vibration propagation member (34, 38, 54) that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face (33, 41, 57) holding the component as vibration parallel thereto, a pressure loader (22, 23, 39, 55, 59) that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater (32, 47, 49, 50, 51, 52, 53) that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes (2a) on its face.

摘要翻译： 一种部件安装装置，包括：一个部件供给器（20），其部件（2）的凸起电极朝下;一个安装头（5），该部件安装在基板（3）上;支撑基座（8） 所述基板以及将所述部件与所述基板对准的定位装置（6,7）。 安装头包括超声波振动发生器（24），超声波振动传播部件（34,38,54），其将由超声波振动发生器提供的超声波振动传递到保持部件的工作面（33,41,57），如 振动平行的压力加载器（22,23,39,55,59），其从垂直于其垂直方向的上方的位置向工作面施加压力负荷;加热器（32,47,49,55,59） 51,52,53），其加热了工作面附近。 因此，即使该部件的面上具有多个凸块电极（2a），也可以高可靠性地进行超声波接合。

公开(公告)号：US06439447B1

公开(公告)日：2002-08-27

申请号：US09763959

申请日：2001-02-28

申请人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa ,  Makoto Akita ,  Kenji Okamoto ,  Shinzo Eguchi ,  Yasuhiro Kametani

发明人： Shozo Minamitani ,  Kazushi Higashi ,  Kenji Takahashi ,  Shinji Kanayama ,  Hiroshi Wada ,  Takafumi Tsujisawa ,  Makoto Akita ,  Kenji Okamoto ,  Shinzo Eguchi ,  Yasuhiro Kametani

IPC分类号： B23K106

CPC分类号： H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/75 ,  H01L2224/759 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00014

摘要： When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.

摘要翻译： 当电子部件上的电极和电路板上的电极部分上的电极通过凸块与电子部件和电路板分别振动时，减振检测装置和判定装置检测由连接件 凸起和电极部分，然后基于振动的阻尼确定接合的良好或有缺陷。 此外，关于超声波振荡器的阻抗，喷嘴的移动量或向VCM供给的电流，将这些接合期间的这些波形与良好接合的波形进行比较，然后确定良好或有缺陷。 根据上述结构，可以在接合期间确定电子部件和电路板之间的接合的良好或有缺陷。 此外，当接合期间接合状态变得错误时，可以改变接合状态。 因此，防止缺陷成分的产生，并且可以提高成品率。

公开(公告)号：US5556456A

公开(公告)日：1996-09-17

申请号：US363882

申请日：1994-12-27

申请人： Hiroki Inoue ,  Yoshiaki Hayashi ,  Hideki Senba ,  Keisuke Ito ,  Makoto Akita

发明人： Hiroki Inoue ,  Yoshiaki Hayashi ,  Hideki Senba ,  Keisuke Ito ,  Makoto Akita

IPC分类号： C09B67/20 ,  C09B19/02 ,  C09B67/22 ,  C08K5/00

CPC分类号： C09B67/0034 ,  C09B19/02

摘要： A pigment composition which comprises an organic pigment and a dioxazine pigment derivative represented by the following formula (I); ##STR1## wherein R.sub.1 and R.sub.2 each independently represents a substituted or unsubstituted and saturated or unsaturated aliphatic hydrocarbon group or aromatic hydrocarbon group, or R.sub.1 and R.sub.2 form a heterocyclic ring; L is an integer of 1-6; m is 0.5-3; and n is 0.5-3.5 provided that total of m and n is 1-5 or a salt thereof; andthe pigment composition can be used with excellent pigment characteristics for various uses, and particularly, when they are used for paints or printing inks in the form of non-aqueous dispersion system, the dispersion system has lower dispersion viscosity and exhibits good flowability and there occurs no color segregation in the dispersion system and it has high coloring power and gives good prints or coats having good gloss and high transparency.

摘要翻译： 一种颜料组合物，其包含由下式（I）表示的有机颜料和二恶嗪颜料衍生物; （I）其中R 1和R 2各自独立地表示取代或未取代的饱和或不饱和的脂族烃基或芳族烃基，或者R 1和R 2形成杂环; L为1-6的整数; m为0.5-3; 并且n为0.5-3.5，条件是m和n的总和为1-5或其盐; 并且颜料组合物可以用于各种用途的优异的颜料特性，特别是当以非水分散体系形式用于油漆或印刷油墨时，分散体系具有较低的分散粘度和显示出良好的流动性，并且在那里 在分散系统中没有发生颜色偏析，并且具有高着色力，并且具有良好的光泽度和高透明度的良好的印刷品或涂层。

公开(公告)号：US08808960B2

公开(公告)日：2014-08-19

申请号：US12719505

申请日：2010-03-08

申请人： Makoto Akita ,  Isao Yoshida ,  Kazuhiko Hashimoto

发明人： Makoto Akita ,  Isao Yoshida ,  Kazuhiko Hashimoto

IPC分类号： G03F7/039 ,  C08F32/08 ,  C08F20/30

CPC分类号： C07C69/00 ,  C07C69/78 ,  C07C2603/24 ,  C08F12/24 ,  C08F212/14 ,  C08F220/30 ,  G03F7/0045 ,  G03F7/0397 ,  C08F220/18 ,  C08F2220/185 ,  C08F2220/303

摘要： A compound represented by the formula (I): wherein R1 represents a hydrogen atom etc., R2 and R3 each independently represent a hydrogen atom etc., R4 represents a C1-C8 divalent hydrocarbon group, R5 represents a single bond etc., and R6 represents an unsubstituted or substituted C6-C20 aromatic hydrocarbon group, a polymer comprising a structural unit derived from the compound represented by the formula (I) and a chemically amplified positive resist composition comprising the polymer, at least one acid generator and at least one solvent.

摘要翻译： 由式（I）表示的化合物：其中R1表示氢原子等，R2和R3各自独立地表示氢原子等，R4表示C1-C8二价烃基，R5表示单键等，以及 R6表示未取代或取代的C6-C20芳族烃基，包含衍生自由式（I）表示的化合物的结构单元的聚合物和包含聚合物，至少一种酸产生剂和至少一种酸 溶剂。

公开(公告)号：US07893293B2

公开(公告)日：2011-02-22

申请号：US12143268

申请日：2008-06-20

申请人： Makoto Akita ,  Isao Yoshida ,  Kazuhiko Hashimoto

发明人： Makoto Akita ,  Isao Yoshida ,  Kazuhiko Hashimoto

IPC分类号： C07C69/753 ,  C07C43/21 ,  C07C43/215 ,  C08F12/32 ,  G03F7/039

CPC分类号： G03F7/0397 ,  C07C69/00 ,  C07C2603/24 ,  C08F212/14 ,  C08F212/34 ,  C08F220/18 ,  G03F7/0045 ,  G03F7/0046 ,  Y10S430/106

摘要： A chemically amplified positive resist composition comprising (A) a resin which comprises (i) a polymerization unit represented by the formula (I): wherein R7 represents a hydrogen atom etc., R8 represents a C1-C4 alkyl group, p represents an integer of 1 to 3, and q represents an integer of 0 to 2, (ii) at least one polymerization unit selected from a group consisting of a polymerization unit represented by the formula (II): wherein R1 represents a hydrogen atom etc., R2 represents a C1-C8 alkyl group and ring X represents an alicyclic hydrocarbon group, and a polymerization unit represented by the formula (IV): wherein R3 represents a hydrogen atom etc., R4 and R5 independently represents a hydrogen atom etc., R10 represents a C1-C6 alkyl group etc., and (iii) a polymerization unit represented by the formula (III): wherein R3, R4 and R5 are the same as defined above, E represents a divalent hydrocarbon group, G represents a single bond etc., Z represents a carbonyl group etc. and L represents an anthryl group etc., and (B) at least one acid generator.

摘要翻译： 一种化学放大正型抗蚀剂组合物，其包含（A）树脂，其包含（i）由式（I）表示的聚合单元：其中R7表示氢原子等，R8表示C1-C4烷基，p表示整数 为1〜3，q为0〜2的整数，（ii）至少一种选自由式（II）表示的聚合单元的聚合单元：其中，R1表示氢原子等，R2 代表C1-C8烷基，X代表脂环族烃基，和由式（Ⅳ）表示的聚合单元：其中R3表示氢原子等，R4和R5独立地表示氢原子等，R10表示 C 1 -C 6烷基等，和（iii）由式（III）表示的聚合单元：其中R3，R4和R5与上述定义相同，E表示二价烃基，G表示单键等 Z表示羰基等，L r 表示蒽基等，和（B）至少一种酸发生剂。