发明申请
US20050263571A1 Injection molded continuously solidified solder method and apparatus
审中-公开
注射成型的连续固化焊料的方法和装置
- 专利标题： Injection molded continuously solidified solder method and apparatus
- 专利标题（中）： 注射成型的连续固化焊料的方法和装置
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申请号： US10857988申请日： 2004-05-30
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公开(公告)号： US20050263571A1公开(公告)日： 2005-12-01
- 发明人: Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
- 申请人： Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
- 主分类号： B23K3/06
- IPC分类号： B23K3/06 ; B23K31/02 ; H05K3/34
摘要：
A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.
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