公开(公告)号：US20050263571A1

公开(公告)日：2005-12-01

申请号：US10857988

申请日：2004-05-30

申请人： Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

发明人： Luc Belanger ,  Guy Brouillette ,  Stephen Buchwalter ,  Peter Gruber ,  Hideo Kimura ,  Jean-Luc Landreville ,  Frederic Manurer ,  Marc Montminy ,  Valerie Oberson ,  Da-Yuan Shih ,  Stephane St-Onge ,  Michel Turgeon ,  Takeshi Yamada

IPC分类号： B23K3/06 ,  B23K31/02 ,  H05K3/34

CPC分类号： B23K3/0623 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338 ,  H05K2203/1121

摘要： A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.

摘要翻译： 一种用于通过熔融焊料沉积形成焊料凸块的方法和装置，紧接在熔融焊料的固化之后，立即在形成的焊料凸块阵列中实现空腔体积的精确复制。 各种焊料填充问题，例如由表面张力和氧化作用引起的焊料填充问题，都是通过组合窄熔融焊料分配槽和分散的熔融焊料的固化来克服的。

公开(公告)号：US20070029277A1

公开(公告)日：2007-02-08

申请号：US11195147

申请日：2005-08-02

申请人： Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

发明人： Lawrence Jacobowitz ,  Stephen Buchwalter ,  Casimer DeCusatis ,  Peter Gruber ,  Da-Yuan Shih

IPC分类号： B29D11/00 ,  B29C35/08 ,  B29C45/00

CPC分类号： H01L27/14685 ,  B29D11/00365 ,  B29D11/00461 ,  B82Y30/00 ,  G02B3/0018 ,  G02B3/0056 ,  G02F1/137 ,  G02F1/29 ,  H01L27/14627 ,  H01L31/02327 ,  H01L33/58

摘要： A wafer-scale apparatus and method is described for the automation of forming, aligning and attaching two-dimensional arrays of microoptic elements on semiconductor and other image display devices, backplanes, optoelectronic boards, and integrated optical systems. In an ordered fabrication sequence, a mold plate comprised of optically designed cavities is formed by reactive ion etching or alternative processes, optionally coated with a release material layer and filled with optically specified materials by an automated fluid-injection and defect-inspection subsystem. Optical alignment fiducials guide the disclosed transfer and attachment processes to achieve specified tolerances between the microoptic elements and corresponding optoelectronic devices and circuits. The present invention applies to spectral filters, waveguides, fiber-optic mode-transformers, diffraction gratings, refractive lenses, diffractive lens/Fresnel zone plates, reflectors, and to combinations of elements and devices, including microelectromechanical systems (MEMS) and liquid crystal device (LCD) matrices for adaptive, tunable elements. Preparation of interfacial layer properties and attachment process embodiments are taught.

摘要翻译： 描述了用于在半导体和其他图像显示装置，背板，光电板和集成光学系统上形成，对准和附着微量元件的二维阵列的自动化的晶片级装置和方法。 在有序的制造顺序中，由光学设计的空腔构成的模具板通过反应离子蚀刻或可选的工艺形成，任选地涂覆有释放材料层，并通过自动化流体注入和缺陷检查子系统填充光学特定的材料。 光学校准基准指导所公开的转移和附着过程以实现微光学元件与对应的光电器件和电路之间的特定公差。 本发明适用于光谱滤波器，波导管，光纤模式变压器，衍射光栅，折射透镜，衍射透镜/菲涅耳带片，反射器以及元件和器件的组合，包括微机电系统（MEMS）和液晶器件 （LCD）矩阵，用于自适应，可调元素。 教导界面层性质和附着工艺实施例的制备。

公开(公告)号：US20060289607A1

公开(公告)日：2006-12-28

申请号：US11168182

申请日：2005-06-28

申请人： Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

发明人： Stephen Buchwalter ,  David Danovitch ,  Frank Egitto ,  Peter Gruber ,  Eric Perfecto ,  Da-Yuan Shih

IPC分类号： B23K35/12

CPC分类号： B23K35/3613

摘要： A method for constructing a composite solder transfer moldplate for flip chip wafer bumping of a substrate, comprising the steps of coating at least one polymer layer onto a first side of a transparent plate, the plate having a thermal expansion coefficient similar to that of the substrate; and forming a multiplicity of cavities in a polymer layer on one side of the plate, each cavity being for receiving solder. A moldplate made by the method. The structure has required behavior through temperature excursions between room temperature and various solder molten temperatures.

摘要翻译： 一种用于构造用于衬底的倒装芯片晶片凸起的复合焊料传递模板的方法，包括以下步骤：将至少一个聚合物层涂覆到透明板的第一侧上，该板具有与衬底的热膨胀系数相似的热膨胀系数 ; 并且在该板的一侧上的聚合物层中形成多个空腔，每个空腔用于接收焊料。 通过该方法制成的模板。 该结构通过室温和各种焊料熔融温度之间的温度偏移需要行为。

公开(公告)号：US20060118604A1

公开(公告)日：2006-06-08

申请号：US11005557

申请日：2004-12-05

申请人： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

发明人： Stephen Buchwalter ,  Claudius Feger ,  Peter Gruber ,  Sung Kang ,  Paul Lauro ,  Da-Yuan Shih

IPC分类号： B23K35/12

CPC分类号： H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

公开(公告)号：US20070246252A1

公开(公告)日：2007-10-25

申请号：US11405405

申请日：2006-04-18

申请人： Stephen Buchwalter ,  Russell Budd

发明人： Stephen Buchwalter ,  Russell Budd

IPC分类号： H01K3/10 ,  H05K1/16

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US20050250248A1

公开(公告)日：2005-11-10

申请号：US11154794

申请日：2005-06-15

申请人： Stephen Buchwalter ,  Claudius Feger ,  Gareth Hougham ,  Nancy LaBianca ,  Hosadurga Shobha

发明人： Stephen Buchwalter ,  Claudius Feger ,  Gareth Hougham ,  Nancy LaBianca ,  Hosadurga Shobha

IPC分类号： C08G65/26 ,  H01L21/56 ,  H01L23/29 ,  H01L21/44

CPC分类号： C08G65/2654 ,  H01L21/563 ,  H01L23/293 ,  H01L24/29 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  Y10T428/12528 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2224/0401

摘要： A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled miocroelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.

摘要翻译： 可重复使用的热固性环氧树脂材料，其允许可再加工的组件，例如可再加工的晶片级底部填充的电子包装。 使用该材料在形成微电子封装中使用可再加工热固性材料的方法。

公开(公告)号：US20060177568A1

公开(公告)日：2006-08-10

申请号：US11049846

申请日：2005-02-04

申请人： Gareth Hougham ,  Leena Buchwalter ,  Stephen Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey Gelorme ,  Kathleen Hinge ,  Anurag Jain ,  Sung Kang ,  John Knickerbocker

发明人： Gareth Hougham ,  Leena Buchwalter ,  Stephen Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey Gelorme ,  Kathleen Hinge ,  Anurag Jain ,  Sung Kang ,  John Knickerbocker

IPC分类号： B05D5/12 ,  H05K3/00 ,  B05C1/00

CPC分类号： H05K3/4053 ,  B05D1/002 ,  H01L21/486 ,  H01L21/76898 ,  H05K2201/09509 ,  H05K2203/1554

摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

摘要翻译： 本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构 支撑或电子部件的保护构件。

公开(公告)号：US20050168947A1

公开(公告)日：2005-08-04

申请号：US10733672

申请日：2003-12-11

申请人： Lawrence Mok ,  Leena Buchwalter ,  Stephen Buchwalter

发明人： Lawrence Mok ,  Leena Buchwalter ,  Stephen Buchwalter

IPC分类号： H01L23/427 ,  H01L23/473 ,  H02B1/00 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/10158 ,  H01L2924/00014

摘要： The invention is directed to structure and methods of improving the cooling capacity of chip packaging modules. The chip packaging module has a substrate with thin-film wiring on one side and grooves or channels etched on one or both sides where coolant pumps are embedded. The coolant pumps are used to enhance the liquid flowing inside the module. The coolant flows through the chips within the vias in the chips or around the chips when the chips do not have vias. Both cooling modes, single or two-phase modes can be adopted in the module.

摘要翻译： 本发明涉及提高芯片封装模块的冷却能力的结构和方法。 芯片封装模块具有在一侧具有薄膜布线的基板，在嵌入有冷却剂泵的一侧或两侧蚀刻的凹槽或通道。 冷却液泵用于增强模块内流动的液体。 当芯片没有通孔时，冷却剂流过芯片内或芯片周围的通孔内的芯片。 模块中可以采用两种冷却模式，单相或双相模式。

公开(公告)号：US06777817B2

公开(公告)日：2004-08-17

申请号：US10654978

申请日：2003-09-05

申请人： Stephen Buchwalter ,  Michael Anthony Gaynes ,  Nancy C. LaBianca ,  Stefano Sergio Oggioni ,  Son K. Tran

发明人： Stephen Buchwalter ,  Michael Anthony Gaynes ,  Nancy C. LaBianca ,  Stefano Sergio Oggioni ,  Son K. Tran

IPC分类号： H01L2348

CPC分类号： H01L24/29 ,  C08G59/24 ,  C08G59/42 ,  H01L21/563 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/29486 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

摘要： Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

摘要翻译： 提供了包含来自二环氧化物的固化反应产物的可再结合的导热粘合剂组合物，其中环氧基团通过无环缩醛部分连接，环状酸酐和导热填料，并用于将半导体器件粘合到芯片载体或散热器。

公开(公告)号：US06617698B2

公开(公告)日：2003-09-09

申请号：US09801655

申请日：2001-03-09

申请人： Stephen Buchwalter ,  Michael Anthony Gaynes ,  Nancy C. LaBianca ,  Stefano Sergio Oggioni ,  Son K. Tran

发明人： Stephen Buchwalter ,  Michael Anthony Gaynes ,  Nancy C. LaBianca ,  Stefano Sergio Oggioni ,  Son K. Tran

IPC分类号： H01L2348

CPC分类号： H01L24/29 ,  C08G59/24 ,  C08G59/42 ,  H01L21/563 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L29/0657 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/29486 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

摘要： Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.