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1.发明申请公开(公告)号：US20050263571A1
公开(公告)日：2005-12-01
申请号：US10857988
申请日：2004-05-30
申请人： Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
发明人： Luc Belanger , Guy Brouillette , Stephen Buchwalter , Peter Gruber , Hideo Kimura , Jean-Luc Landreville , Frederic Manurer , Marc Montminy , Valerie Oberson , Da-Yuan Shih , Stephane St-Onge , Michel Turgeon , Takeshi Yamada
CPC分类号： B23K3/0623 , H05K3/3457 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338 , H05K2203/1121
摘要： A method and apparatus for forming solder bumps by molten solder deposition into cavity arrays in a substrate immediately followed by solidification of molten solder such that precise replication of cavity volumes is consistently achieved in formed solder bump arrays. Various solder filling problems, such as those caused by surface tension and oxidation effects, are overcome by a combination of narrow molten Solder dispense slots and solidification of dispensed molten solder.
摘要翻译： 一种用于通过熔融焊料沉积形成焊料凸块的方法和装置，紧接在熔融焊料的固化之后，立即在形成的焊料凸块阵列中实现空腔体积的精确复制。 各种焊料填充问题，例如由表面张力和氧化作用引起的焊料填充问题，都是通过组合窄熔融焊料分配槽和分散的熔融焊料的固化来克服的。
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公开(公告)号：US20060035454A1
公开(公告)日：2006-02-16
申请号：US11048578
申请日：2005-02-01
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/05572 , H01L2224/05644 , H01L2224/05647 , H01L2224/11003 , H01L2224/111 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/94 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H05K3/3468 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/087 , H05K2203/1157 , H05K2203/128 , H01L2924/0105 , H01L2224/11 , H01L2224/05099
摘要： Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.
摘要翻译： 公开了一种允许从注射成型焊料（IMS）产生的焊料特征从模板向焊料接收衬底的转移和回流而不使用焊剂的新方法。 几种实施方式分别产生焊料转移和回流，或者在一起并且在氮气中使用甲酸蒸气或部分浓度的氢作为氧化物还原气氛。 最终实施例通过在焊料填充的模具板和焊料接收衬底之间使用超声波振动，仅在氮气中产生无磁通转移和回流。
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公开(公告)号：US20120217290A1
公开(公告)日：2012-08-30
申请号：US13438213
申请日：2012-04-03
申请人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
发明人： Kang-Wook Lee , Nathalie Normand , Valerie Oberson
IPC分类号： B23K1/20 , B23K35/363
CPC分类号： B23K35/362 , B23K1/0016 , B23K35/262 , B23K35/3601 , B23K35/3612 , B23K35/3618
摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明涉及助焊剂组合物及其用途。 一种组合物包含活化剂和溶剂，其分子量为200-500的甘油乙氧基化物。 另一组合物包含活化剂，溶剂为分子量为200-500的甘油乙氧基化物和胺。 还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。
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公开(公告)号：US08444774B2
公开(公告)日：2013-05-21
申请号：US12731369
申请日：2010-03-25
申请人： Eric Duschesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duschesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B23K35/34
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US20130001279A1
公开(公告)日：2013-01-03
申请号：US13613000
申请日：2012-09-13
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
摘要翻译： 本发明还涉及一种用于接合物体的焊接方法，其包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分上并连接物体。
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公开(公告)号：US20100175790A1
公开(公告)日：2010-07-15
申请号：US12731369
申请日：2010-03-25
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US09808874B2
公开(公告)日：2017-11-07
申请号：US13613000
申请日：2012-09-13
IPC分类号： B23K1/00 , B23K35/36 , B23K35/362
CPC分类号： B23K1/0016 , B23K35/3601 , B23K35/362
摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.
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公开(公告)号：US20090039140A1
公开(公告)日：2009-02-12
申请号：US11834438
申请日：2007-08-06
申请人： Raschid Jose Bezama , Russell Alan Budd , Evan George Colgan , Peter Alfred Gruber , Valerie Oberson
发明人： Raschid Jose Bezama , Russell Alan Budd , Evan George Colgan , Peter Alfred Gruber , Valerie Oberson
CPC分类号： B23K3/0638 , B23K2101/40 , H05K3/3457 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338 , H05K2203/1178
摘要： A solder mold for transferring solder to a wafer includes a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels formed between the plurality of solder cavities.
摘要翻译： 用于将焊料转移到晶片的焊接模具包括：衬底，用于保持焊料的多个焊料腔，以及在所述多个焊料腔之间形成的多个通气通道。
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公开(公告)号：US20080124568A1
公开(公告)日：2008-05-29
申请号：US11493724
申请日：2006-07-26
申请人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
发明人： Eric Duchesne , Kang-Wook Lee , Valerie Oberson
IPC分类号： B32B15/01 , B23K1/00 , B23K35/363
CPC分类号： B23K35/362 , Y10T428/12493
摘要： The invention relates to a composition of matter comprising a soldering flux, wherein the flux consists essentially of a combination of a fluxing agent and a solvent, and wherein the fluxing agent comprises a keto acid such as levulinic acid or acetylbutyric acid. The flux may also comprises an ester acid, or comprises a mixture of the keto acid with the ester acid. The solvent comprises a mixture of a tacky solvent with a non-tacky solvent. The invention also relates to a process comprising soldering at least two surfaces together, each of which comprises a metal area to which solder can adhere by employing the following steps in any order: applying solder to at least one of the metal areas, aligning the metal areas so that they are superimposed over one another, heating at least one of the areas to a temperature that comprises at least the melting temperature of the solder. The last step comprises joining the superimposed areas to one another. The process employs the flux composition operatively associated with the solder, and in one embodiment the invention comprises a mixture of the flux composition with powdered solder. In another embodiment, the process comprises IMS, C4 and C4NP processes and the solder comprises a lead free solder. The invention also comprises a product produced by the foregoing process or processes.
摘要翻译： 本发明涉及包含助焊剂的物质组合物，其中助熔剂基本上由助熔剂和溶剂的组合组成，并且其中助熔剂包括酮酸，例如乙酰丙酸或乙酰基丁酸。 助熔剂还可以包含酯酸，或包含酮酸与酯酸的混合物。 溶剂包括粘性溶剂与非粘性溶剂的混合物。 本发明还涉及一种方法，其包括将至少两个表面焊接在一起，每个表面包括金属区域，焊料可以以任何顺序通过以下步骤粘附到该金属区域：将焊料施加到至少一个金属区域，使金属对准 区域，使得它们彼此叠加，将至少一个区域加热至至少包括焊料的熔化温度的温度。 最后一步包括将叠加的区域相互连接。 该方法使用与焊料可操作地相关联的助熔剂组合物，并且在一个实施方案中，本发明包括焊剂组合物与粉末焊料的混合物。 在另一个实施方案中，该方法包括IMS，C4和C4NP方法，焊料包括无铅焊料。 本发明还包括通过前述方法或方法生产的产品。
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公开(公告)号：US08268716B2
公开(公告)日：2012-09-18
申请号：US12894231
申请日：2010-09-30
申请人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
发明人： Charles L. Arvin , Valerie Oberson , Srinivasa N. Reddy , Krystyna W. Semkow , Richard A. Shelleman , Kamalesh K. Srivistava
IPC分类号： H01L21/44
CPC分类号： H01L24/16 , H01L23/15 , H01L23/49811 , H01L24/13 , H01L24/81 , H01L2224/13166 , H01L2224/16237 , H01L2224/16238 , H01L2224/16507 , H01L2224/81191 , H01L2224/81192 , H01L2224/81444 , H01L2224/81815 , H01L2924/01327 , H01L2924/14 , H01L2924/00012 , H01L2924/014 , H01L2924/00014 , H01L2924/00
摘要： A method of coupling an integrated circuit to a substrate includes providing the substrate, forming a contact pad in the substrate, contacting the contact pad with a solder ball, and repeatedly exposing the solder ball to a thermal process to cause intermetallics based on a metal in the contact pad to be formed in the thermal ball.
摘要翻译： 将集成电路耦合到衬底的方法包括提供衬底，在衬底中形成接触焊盘，使接触焊盘与焊球接触，并且将焊球重复地暴露于热处理以引起基于金属的金属间化合物 接触垫将形成在热球中。
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