发明申请
- 专利标题: Amine-free deposition of metal-nitride films
- 专利标题(中): 无氮化物沉积金属氮化物膜
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申请号: US11240005申请日: 2005-09-30
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公开(公告)号: US20070075427A1公开(公告)日: 2007-04-05
- 发明人: Adrien Lavoie , Valery Dubin , Juan Dominguez , Kevin O'Brien , Steven Johnston , John Peck , David Thompson , David Peters
- 申请人: Adrien Lavoie , Valery Dubin , Juan Dominguez , Kevin O'Brien , Steven Johnston , John Peck , David Thompson , David Peters
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L21/44
摘要:
A method for forming a metal carbide layer begins with providing a substrate, an organometallic precursor material, at least one doping agent such as nitrogen, and a plasma such as a hydrogen plasma. The substrate is placed within a reaction chamber; and heated. A process cycle is then performed, where the process cycle includes pulsing the organometallic precursor material into the reaction chamber, pulsing the doping agent into the reaction chamber, and pulsing the plasma into the reaction chamber, such that the organometallic precursor material, the doping agent, and the plasma react at the surface of the substrate to form a metal carbide layer. The process cycles can be repeated and varied to form a graded metal carbide layer.
公开/授权文献
- US07550385B2 Amine-free deposition of metal-nitride films 公开/授权日:2009-06-23
信息查询
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